V. Videkov, Mariya Aleksandrova, B. Tzaneva, S. Andreev
{"title":"制备扩散焊膏用铜纳米线焊剂","authors":"V. Videkov, Mariya Aleksandrova, B. Tzaneva, S. Andreev","doi":"10.1109/ET50336.2020.9238307","DOIUrl":null,"url":null,"abstract":"The paper presents a study of the possibility of adding copper nanowires to standard solder pastes in order to obtain diffuse soldering. An approach for pre-mixing the nanowires with flux and their subsequential addition to the solder paste was considered. A method for investigation of the stability of the copper nanowires in different fluxes was proposed. Results, related to the stability study were also presented.","PeriodicalId":178356,"journal":{"name":"2020 XXIX International Scientific Conference Electronics (ET)","volume":"135 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2020-09-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Copper Nanowires Filler to Fluxes for Fabrication of Diffusion Soldering Paste\",\"authors\":\"V. Videkov, Mariya Aleksandrova, B. Tzaneva, S. Andreev\",\"doi\":\"10.1109/ET50336.2020.9238307\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The paper presents a study of the possibility of adding copper nanowires to standard solder pastes in order to obtain diffuse soldering. An approach for pre-mixing the nanowires with flux and their subsequential addition to the solder paste was considered. A method for investigation of the stability of the copper nanowires in different fluxes was proposed. Results, related to the stability study were also presented.\",\"PeriodicalId\":178356,\"journal\":{\"name\":\"2020 XXIX International Scientific Conference Electronics (ET)\",\"volume\":\"135 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2020-09-16\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2020 XXIX International Scientific Conference Electronics (ET)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ET50336.2020.9238307\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 XXIX International Scientific Conference Electronics (ET)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ET50336.2020.9238307","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Copper Nanowires Filler to Fluxes for Fabrication of Diffusion Soldering Paste
The paper presents a study of the possibility of adding copper nanowires to standard solder pastes in order to obtain diffuse soldering. An approach for pre-mixing the nanowires with flux and their subsequential addition to the solder paste was considered. A method for investigation of the stability of the copper nanowires in different fluxes was proposed. Results, related to the stability study were also presented.
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