Au/n-GaAs型M/S结构串联电阻效应的温度敏感性比较

E. Evcin Baydilli
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引用次数: 0

摘要

为了与文献进行比较,本研究试图评估Au/n-GaAs型M/S结构的串联电阻(Rs)特征的温度敏感性,这是可以接受的基准样品。利用欧姆、诺德和张氏函数分别计算了样品的串联电阻特性。用于计算的电流-电压(I-V)数据在+2V和- 2V之间的电压值和120K和360K之间的温度值下以60K步进行评估。并对各种计算方法进行了比较。因此,使用欧姆、诺德函数和张氏函数的原理计算的Rs值随着温度的升高而减小,正如文献结果所预测的那样。此外,确定了Rs的温度敏感性在所有计算方法中都是一致的,只有微小的变化。此外,通过与文献的比较,得出了当金属-半导体接触区域存在聚合物界面层时,串联电阻不是一个问题。M/S结构的Rs参数本质上是温度和输入电压的敏感函数。
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The Comparison of the Temperature Susceptibility of the Serial Resistance Effect of Au/n-GaAs Type M/S Structures
To enable comparison with the literature, this study seeks to assess the temperature susceptibility of serial resistance (Rs) features of the Au/n-GaAs type M/S structure, which is acceptable the benchmark sample. The serial resistance features of the sample were computed separately withal principal of Ohm, Norde, and Cheungs' functions. The current-voltage (I-V) data used in order to compute were evaluated at the voltage values between +2V and -2 V and temperature values between 120K and 360K in 60K steps. Each computation method was also compared one another other. As a result, the fact that the Rs values computed using principal of Ohm, Norde functions and Cheungs' functions tended to reduce with rising temperature, as anticipated by the literature results. In addition, it was determined that, with only tiny variations, the temperature susceptibility of Rs is consistent across all computation methods. In addition, as a result of the comparison with the literature, it was concluded serial resistance is less of an issue when a polymer interfacial layer is present at the metal-semiconductor contact region. The Rs parameter of the M/S structure is, in essence, a sensitive function of temperature and input voltage.
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