低温聚合物键合制备功能SU-8-PET复合微芯片

R. Yamamoto, K. Sueyoshi, K. Otsuka
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引用次数: 0

摘要

采用低温聚合物键合技术,研制了由SU-8- pet微芯片组成的Au沉积SU-8微点。采用电子束光刻技术(EBL),以SU-8为负调色抗蚀剂,制备了一个精细的微点阵列(面积为50μm×5mm,间距为2μm的1μm×1μm×0.5μm点)。在玻璃基板上用UV图案的SU-8形成微通道结构。SU-8结构采用PET薄膜低温硅烷偶联键合(140oC, 1.5MPa, 5min)密封。该微芯片制备成功,无泄漏,可用于微芯片电泳。
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Functional SU-8-PET composite microchip including Au microdot array fabricated by low temperature polymer bonding
Au deposited SU-8 microdots comprised SU-8-PET microchip using low temperature polymer bonding technology is developed. A fine microdot array (1μm×1μm×0.5μm dots with 2μm pitch in area of 50μm×5mm) is fabricated by electron beam lithography (EBL) using SU-8 as a negative tone resist. A microchannel structure is formed with UV patterned SU-8 on a glass substrate. The SU-8 structure is sealed with a PET film by low temperature silane coupling bonding (140oC, 1.5MPa, 5min). The proposed microchip is fabricated successfully without leakage and is applicable as a microchip electrophoresis.
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