{"title":"具有慢波效应的微带传输线的特性与建模","authors":"T. Masuda, N. Shiramizu, T. Nakamura, K. Washio","doi":"10.1109/SMIC.2008.45","DOIUrl":null,"url":null,"abstract":"We propose a modeling methodology to determine the optimum dimensions of slots in ground shield metal of slow-wave transmission lines. We induce a mutual inductance between a signal conductor and return ground current paths to express an equivalent inductance of the transmission line. The model's accuracy is confirmed by characterization of a fabricated transmission line TEG.","PeriodicalId":350325,"journal":{"name":"2008 IEEE Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems","volume":"36 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2008-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"15","resultStr":"{\"title\":\"Characterization and Modeling of Microstrip Transmission Lines with Slow-Wave Effect\",\"authors\":\"T. Masuda, N. Shiramizu, T. Nakamura, K. Washio\",\"doi\":\"10.1109/SMIC.2008.45\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We propose a modeling methodology to determine the optimum dimensions of slots in ground shield metal of slow-wave transmission lines. We induce a mutual inductance between a signal conductor and return ground current paths to express an equivalent inductance of the transmission line. The model's accuracy is confirmed by characterization of a fabricated transmission line TEG.\",\"PeriodicalId\":350325,\"journal\":{\"name\":\"2008 IEEE Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems\",\"volume\":\"36 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2008-02-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"15\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2008 IEEE Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/SMIC.2008.45\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2008 IEEE Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SMIC.2008.45","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Characterization and Modeling of Microstrip Transmission Lines with Slow-Wave Effect
We propose a modeling methodology to determine the optimum dimensions of slots in ground shield metal of slow-wave transmission lines. We induce a mutual inductance between a signal conductor and return ground current paths to express an equivalent inductance of the transmission line. The model's accuracy is confirmed by characterization of a fabricated transmission line TEG.