增强输电网解耦的仿真方法

G. Benoit, Gautier Cyrille, Amedeo Alexandre
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引用次数: 4

摘要

本文介绍了一种优化集成电路(如处理器或现场可编程门阵列)去耦网络的仿真方法。通过将仿真结果与裸PCB和与去耦电容相关的PCB的S参数分析的测量结果相关联,证明了商用电子计算机辅助设计解决方案的仿真工具的效率,这得益于配备SMA连接器的专用测试车,可以测量S12参数。由于电容的安装电感是解耦优化的基本要素,因此本文还给出了商用解决方案的集成模块。然后给出了在重复使用电子设计的情况下优化电容器网络去耦性能的设计流程。首先减少去耦元件的占用面积,并通过减小安装电感来提高去耦效率。然后分析解耦网络的性能,以去除所有不必要的元素。
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Simulation methodology for enhancement of power delivery network decoupling
The following paper presents the simulation methodology for optimizing the decoupling network of an integrated circuit like a processor or a Field Programmable Gate Array. The efficiency of simulation tools from commercial electronic computer aided design solution is demonstrated by correlating simulation results with measurement for S parameters analysis of bare PCB and the PCB associated with decoupling capacitors thanks to a dedicated test vehicle equipped with SMA connectors allowing S12 parameter measurement. An integrated module of the commercial solution calculating mounted inductance of capacitors is also presented as it is an essential element for decoupling optimization. Design flow is then given for optimizing the decoupling performance of a capacitor network in the case of reusing a electronic design. Surface occupied by decoupling components is firstly reduced and its efficiency increased by reducing mounted inductance. Performances of decoupling network are then analyzed in order to remove all unnecessary elements.
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