{"title":"复合电路板模态分析与结构优化","authors":"Tian-yu Gao","doi":"10.1109/ICNISC54316.2021.00071","DOIUrl":null,"url":null,"abstract":"Vibration has a great effect on electronic components. In this paper, the finite element technology is used to establish a finite element model of a circuit board. By analyzing the vibration characteristics of the circuit board, the installation structure of the circuit board is improved, and the position size of the installation point of the circuit board is optimized, and the optimal structure size of the circuit board is obtained.","PeriodicalId":396802,"journal":{"name":"2021 7th Annual International Conference on Network and Information Systems for Computers (ICNISC)","volume":"58 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2021-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Modal Analysis and Structure Optimization of Composite Circuit Board\",\"authors\":\"Tian-yu Gao\",\"doi\":\"10.1109/ICNISC54316.2021.00071\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Vibration has a great effect on electronic components. In this paper, the finite element technology is used to establish a finite element model of a circuit board. By analyzing the vibration characteristics of the circuit board, the installation structure of the circuit board is improved, and the position size of the installation point of the circuit board is optimized, and the optimal structure size of the circuit board is obtained.\",\"PeriodicalId\":396802,\"journal\":{\"name\":\"2021 7th Annual International Conference on Network and Information Systems for Computers (ICNISC)\",\"volume\":\"58 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2021-07-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2021 7th Annual International Conference on Network and Information Systems for Computers (ICNISC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICNISC54316.2021.00071\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2021 7th Annual International Conference on Network and Information Systems for Computers (ICNISC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICNISC54316.2021.00071","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Modal Analysis and Structure Optimization of Composite Circuit Board
Vibration has a great effect on electronic components. In this paper, the finite element technology is used to establish a finite element model of a circuit board. By analyzing the vibration characteristics of the circuit board, the installation structure of the circuit board is improved, and the position size of the installation point of the circuit board is optimized, and the optimal structure size of the circuit board is obtained.
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