Measurement with intelligent measuring system of PCB deformation when separating modules from a panel

By using an intelligent measuring system, the necessary preparation and measurement of the deformation of the PCB during the separation of the module (board with mounted electronic components) from the panel was performed. An area of critical deformation is defined based on the standards for testing in surface mounting. The results of practical measurements of deformations after separation of modules from panels are presented. A conclusion is made on the basis of the obtained results with conclusions regarding the admissibility of the process according to the standard.