B. Geynet, P. Chevalier, S. Chouteau, G. Avenier, T. Schwartzmann, D. Gloria, G. Dambrine, F. Danneville, A. Chantre
{"title":"与高速SiGe BiCMOS技术兼容的高压HBTs","authors":"B. Geynet, P. Chevalier, S. Chouteau, G. Avenier, T. Schwartzmann, D. Gloria, G. Dambrine, F. Danneville, A. Chantre","doi":"10.1109/SMIC.2008.59","DOIUrl":null,"url":null,"abstract":"This paper describes the integration of high-voltage HBTs in a high-speed SiGe BiCMOS technology. HBTs with BVCEO from 2 V to 5 V featuring an all-implanted collector and fully compatible with a 230-GHz fT BiCMOS technology have been fabricated using only one additional mask.","PeriodicalId":350325,"journal":{"name":"2008 IEEE Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems","volume":"5 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2008-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"High-Voltage HBTs Compatible with High-Speed SiGe BiCMOS Technology\",\"authors\":\"B. Geynet, P. Chevalier, S. Chouteau, G. Avenier, T. Schwartzmann, D. Gloria, G. Dambrine, F. Danneville, A. Chantre\",\"doi\":\"10.1109/SMIC.2008.59\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper describes the integration of high-voltage HBTs in a high-speed SiGe BiCMOS technology. HBTs with BVCEO from 2 V to 5 V featuring an all-implanted collector and fully compatible with a 230-GHz fT BiCMOS technology have been fabricated using only one additional mask.\",\"PeriodicalId\":350325,\"journal\":{\"name\":\"2008 IEEE Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems\",\"volume\":\"5 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2008-02-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2008 IEEE Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/SMIC.2008.59\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2008 IEEE Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SMIC.2008.59","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
摘要
本文介绍了高压HBTs在高速SiGe BiCMOS技术中的集成。BVCEO范围从2v到5v的hbt具有全植入集电极,完全兼容230 ghz fT BiCMOS技术,仅使用一个额外的掩模就可以制造出来。
High-Voltage HBTs Compatible with High-Speed SiGe BiCMOS Technology
This paper describes the integration of high-voltage HBTs in a high-speed SiGe BiCMOS technology. HBTs with BVCEO from 2 V to 5 V featuring an all-implanted collector and fully compatible with a 230-GHz fT BiCMOS technology have been fabricated using only one additional mask.