{"title":"三维多模信道解码的热感知核映射","authors":"Shu-Yen Lin, Cheng-Hung Lin, Ho-Yun Su","doi":"10.1109/GCCE.2014.7031240","DOIUrl":null,"url":null,"abstract":"In this work, three thermal-aware kernel mappings are proposed for a three-dimensional multi-mode channel decoding architecture. The proposed kernel mappings can reduce the peak temperature and support different thermal and latency constraints. In our experiments, we show the peak temperature can be reduced from 16.2°C~33.8°C. Besides, we also demonstrate that different mapping is chosen under different thermal and latency constraints.","PeriodicalId":145771,"journal":{"name":"2014 IEEE 3rd Global Conference on Consumer Electronics (GCCE)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2014-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Thermal-aware kernel mapping for three-dimensional multi-mode channel decoding\",\"authors\":\"Shu-Yen Lin, Cheng-Hung Lin, Ho-Yun Su\",\"doi\":\"10.1109/GCCE.2014.7031240\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this work, three thermal-aware kernel mappings are proposed for a three-dimensional multi-mode channel decoding architecture. The proposed kernel mappings can reduce the peak temperature and support different thermal and latency constraints. In our experiments, we show the peak temperature can be reduced from 16.2°C~33.8°C. Besides, we also demonstrate that different mapping is chosen under different thermal and latency constraints.\",\"PeriodicalId\":145771,\"journal\":{\"name\":\"2014 IEEE 3rd Global Conference on Consumer Electronics (GCCE)\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2014-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2014 IEEE 3rd Global Conference on Consumer Electronics (GCCE)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/GCCE.2014.7031240\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2014 IEEE 3rd Global Conference on Consumer Electronics (GCCE)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/GCCE.2014.7031240","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Thermal-aware kernel mapping for three-dimensional multi-mode channel decoding
In this work, three thermal-aware kernel mappings are proposed for a three-dimensional multi-mode channel decoding architecture. The proposed kernel mappings can reduce the peak temperature and support different thermal and latency constraints. In our experiments, we show the peak temperature can be reduced from 16.2°C~33.8°C. Besides, we also demonstrate that different mapping is chosen under different thermal and latency constraints.