A. Brown, A. Frommhold, T. Lada, J. Bowen, Z. el Otell, A. Robinson
{"title":"利用富勒烯衍生物的碳自旋硬掩膜","authors":"A. Brown, A. Frommhold, T. Lada, J. Bowen, Z. el Otell, A. Robinson","doi":"10.1117/12.2219212","DOIUrl":null,"url":null,"abstract":"We have developed a range of fullerene containing materials for use as organic hard masks. Recent advances in material development are reported together with some results from external evaluations of the original HM100 series. Initial results for the new HM340-383-010 formulation show it to have a high thermal stability (~5.5 % mass loss at 400°C) and a very high carbon content (at 95.3%), offering high etch durability.","PeriodicalId":193904,"journal":{"name":"SPIE Advanced Lithography","volume":"7 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-03-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":"{\"title\":\"Spin-on-carbon hard masks utilising fullerene derivatives\",\"authors\":\"A. Brown, A. Frommhold, T. Lada, J. Bowen, Z. el Otell, A. Robinson\",\"doi\":\"10.1117/12.2219212\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We have developed a range of fullerene containing materials for use as organic hard masks. Recent advances in material development are reported together with some results from external evaluations of the original HM100 series. Initial results for the new HM340-383-010 formulation show it to have a high thermal stability (~5.5 % mass loss at 400°C) and a very high carbon content (at 95.3%), offering high etch durability.\",\"PeriodicalId\":193904,\"journal\":{\"name\":\"SPIE Advanced Lithography\",\"volume\":\"7 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2016-03-25\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"5\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"SPIE Advanced Lithography\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1117/12.2219212\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"SPIE Advanced Lithography","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1117/12.2219212","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Spin-on-carbon hard masks utilising fullerene derivatives
We have developed a range of fullerene containing materials for use as organic hard masks. Recent advances in material development are reported together with some results from external evaluations of the original HM100 series. Initial results for the new HM340-383-010 formulation show it to have a high thermal stability (~5.5 % mass loss at 400°C) and a very high carbon content (at 95.3%), offering high etch durability.