H. Shinkawata, Nobuo Tsuboi, A. Tsuda, Shingo Sato, Yasuo Yamaguchi
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Development of a compacted doubly nesting array in Narrow Scribe Line aimed at detecting soft failures of interconnect via
We introduce a new addressable test structure array using for mass production stage which is compacted doubly nesting array into Narrow Scribe Line which named as High sensitivity-Screening and Detection-decoder test structure in Scribe line (HSD-S). Abnormally high resistance as a soft failure via was detected and located in a 40nm CMOS technology. We captured a soft failure bit which had a high resistance via exhibiting over 160 times larger one.
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