单片三维集成电路供电网络的频域和时域分析

Kyungwook Chang, Shidhartha Das, S. Sinha, B. Cline, G. Yeric, S. Lim
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引用次数: 10

摘要

随着二维缩放达到极限,单片三维集成电路(M3D)是继续等效缩放的主要竞争者。尽管M3D在功率和性能方面优于2D设计,但为M3D设计电力输送网络(PDN)具有挑战性。在本文中,我们首次提出了M3D设计的系统级PDN模型,重点关注电源完整性的电阻(IR)和电感(Ldi/dt)组件。此外,我们还对M3D PDN进行了频域和时域分析。我们发现,M3D PDN中的附加电阻虽然对电阻下降不利,但在最坏情况下的谐振振荡中,其峰值阻抗降低了35.9%,从而提高了对电流噪声的弹性。
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Frequency and time domain analysis of power delivery network for monolithic 3D ICs
As 2D scaling reaches its limit, monolithic 3D IC (M3D) is a leading contender to continue equivalent scaling. Although M3D shows power and performance benefits over 2D designs, designing a power delivery network (PDN) for M3D is challenging. In this paper, for the first time, we present a system-level PDN model of M3D designs focusing on both resistive (IR) and inductive (Ldi/dt) components of power-supply integrity. In addition, we present frequency- and time-domain analysis of the M3D PDN. We show that the additional resistance in the M3D PDN, while being worse for resistive drops, improves resiliency against current noise showing 35.9% peak impedance reduction during worst-case resonant oscillations.
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