E. G. Colgan, B. Furman, M. Gaynes, W. Graham, N. LaBianca, J. H. Magerlein, R. J. Polastre, M. B. Rothwell, R. J. Bezama, R. Choudhary, K. Marston, H. Toy, J. Wakil, J. Zitz, R. Schmidt, Ibm Poughkeepsie
{"title":"大功率芯片用硅微通道冷却器的实际实现","authors":"E. G. Colgan, B. Furman, M. Gaynes, W. Graham, N. LaBianca, J. H. Magerlein, R. J. Polastre, M. B. Rothwell, R. J. Bezama, R. Choudhary, K. Marston, H. Toy, J. Wakil, J. Zitz, R. Schmidt, Ibm Poughkeepsie","doi":"10.1109/STHERM.2005.1412151","DOIUrl":null,"url":null,"abstract":"The paper describes a practical implementation of a single-phase Si microchannel cooler designed for cooling very high power chips such as microprocessors. Through the use of multiple heat exchanger zones and optimized cooler fin designs, a unit thermal resistance of 10.5 C-mm/sup 2//W from the cooler surface to the inlet water was demonstrated with a fluid pressure drop of less than 35 kPa. Further, cooling of a thermal test chip with a microchannel cooler bonded to it packaged in a single chip module was also demonstrated for a chip power density greater than 300 W/cm/sup 2/. Coolers of this design should be able to cool chips with average power densities of 400 W/cm/sup 2/ or more.","PeriodicalId":256936,"journal":{"name":"Semiconductor Thermal Measurement and Management IEEE Twenty First Annual IEEE Symposium, 2005.","volume":"3 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2005-03-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"218","resultStr":"{\"title\":\"A practical implementation of silicon microchannel coolers for high power chips\",\"authors\":\"E. G. Colgan, B. Furman, M. Gaynes, W. Graham, N. LaBianca, J. H. Magerlein, R. J. Polastre, M. B. Rothwell, R. J. Bezama, R. Choudhary, K. Marston, H. Toy, J. Wakil, J. Zitz, R. Schmidt, Ibm Poughkeepsie\",\"doi\":\"10.1109/STHERM.2005.1412151\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The paper describes a practical implementation of a single-phase Si microchannel cooler designed for cooling very high power chips such as microprocessors. Through the use of multiple heat exchanger zones and optimized cooler fin designs, a unit thermal resistance of 10.5 C-mm/sup 2//W from the cooler surface to the inlet water was demonstrated with a fluid pressure drop of less than 35 kPa. Further, cooling of a thermal test chip with a microchannel cooler bonded to it packaged in a single chip module was also demonstrated for a chip power density greater than 300 W/cm/sup 2/. Coolers of this design should be able to cool chips with average power densities of 400 W/cm/sup 2/ or more.\",\"PeriodicalId\":256936,\"journal\":{\"name\":\"Semiconductor Thermal Measurement and Management IEEE Twenty First Annual IEEE Symposium, 2005.\",\"volume\":\"3 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2005-03-15\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"218\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Semiconductor Thermal Measurement and Management IEEE Twenty First Annual IEEE Symposium, 2005.\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/STHERM.2005.1412151\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Semiconductor Thermal Measurement and Management IEEE Twenty First Annual IEEE Symposium, 2005.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/STHERM.2005.1412151","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A practical implementation of silicon microchannel coolers for high power chips
The paper describes a practical implementation of a single-phase Si microchannel cooler designed for cooling very high power chips such as microprocessors. Through the use of multiple heat exchanger zones and optimized cooler fin designs, a unit thermal resistance of 10.5 C-mm/sup 2//W from the cooler surface to the inlet water was demonstrated with a fluid pressure drop of less than 35 kPa. Further, cooling of a thermal test chip with a microchannel cooler bonded to it packaged in a single chip module was also demonstrated for a chip power density greater than 300 W/cm/sup 2/. Coolers of this design should be able to cool chips with average power densities of 400 W/cm/sup 2/ or more.
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