{"title":"潜在的热安全风险","authors":"Puyan Dadvar, K. Skadron","doi":"10.1109/STHERM.2005.1412184","DOIUrl":null,"url":null,"abstract":"Hardware and software techniques for controlling a microprocessor's power and cooling have the undesirable side effect of creating a security risk. They allow a malicious program to control the chip's operating temperature and potentially cause denial of service or even permanent damage. The paper provides an overview of the various vulnerabilities, their costs, and offers preliminary suggestions on how to reduce these risks.","PeriodicalId":256936,"journal":{"name":"Semiconductor Thermal Measurement and Management IEEE Twenty First Annual IEEE Symposium, 2005.","volume":"19 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2005-03-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"44","resultStr":"{\"title\":\"Potential thermal security risks\",\"authors\":\"Puyan Dadvar, K. Skadron\",\"doi\":\"10.1109/STHERM.2005.1412184\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Hardware and software techniques for controlling a microprocessor's power and cooling have the undesirable side effect of creating a security risk. They allow a malicious program to control the chip's operating temperature and potentially cause denial of service or even permanent damage. The paper provides an overview of the various vulnerabilities, their costs, and offers preliminary suggestions on how to reduce these risks.\",\"PeriodicalId\":256936,\"journal\":{\"name\":\"Semiconductor Thermal Measurement and Management IEEE Twenty First Annual IEEE Symposium, 2005.\",\"volume\":\"19 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2005-03-15\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"44\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Semiconductor Thermal Measurement and Management IEEE Twenty First Annual IEEE Symposium, 2005.\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/STHERM.2005.1412184\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Semiconductor Thermal Measurement and Management IEEE Twenty First Annual IEEE Symposium, 2005.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/STHERM.2005.1412184","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Hardware and software techniques for controlling a microprocessor's power and cooling have the undesirable side effect of creating a security risk. They allow a malicious program to control the chip's operating temperature and potentially cause denial of service or even permanent damage. The paper provides an overview of the various vulnerabilities, their costs, and offers preliminary suggestions on how to reduce these risks.
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