一种用于HCl SOA增强的新型高压LDMOS屏蔽触点结构

Hsin-Liang Liu, Z. Jhou, Shih-Teng Huang, Shu‐Wha Lin, Ke-Feng Lin, Chiu-Te Lee, Chih-Chong Wang
{"title":"一种用于HCl SOA增强的新型高压LDMOS屏蔽触点结构","authors":"Hsin-Liang Liu, Z. Jhou, Shih-Teng Huang, Shu‐Wha Lin, Ke-Feng Lin, Chiu-Te Lee, Chih-Chong Wang","doi":"10.23919/ISPSD.2017.7988966","DOIUrl":null,"url":null,"abstract":"This paper demonstrated a novel LDMOS with gate-connected shielding-contact structure, no extra mask or process is needed. TCAD simulation reveals lower electrical potential and impact ionization with the proposed structure. Ron-sp/BVD ratio reduction and significant HCl SOA improvement have been verified on real Silicon. Newly layout with Slot-Poly design has been investigated for better process control as well.","PeriodicalId":202561,"journal":{"name":"2017 29th International Symposium on Power Semiconductor Devices and IC's (ISPSD)","volume":"102 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2017-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":"{\"title\":\"A novel high-voltage LDMOS with shielding-contact structure for HCl SOA enhancement\",\"authors\":\"Hsin-Liang Liu, Z. Jhou, Shih-Teng Huang, Shu‐Wha Lin, Ke-Feng Lin, Chiu-Te Lee, Chih-Chong Wang\",\"doi\":\"10.23919/ISPSD.2017.7988966\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper demonstrated a novel LDMOS with gate-connected shielding-contact structure, no extra mask or process is needed. TCAD simulation reveals lower electrical potential and impact ionization with the proposed structure. Ron-sp/BVD ratio reduction and significant HCl SOA improvement have been verified on real Silicon. Newly layout with Slot-Poly design has been investigated for better process control as well.\",\"PeriodicalId\":202561,\"journal\":{\"name\":\"2017 29th International Symposium on Power Semiconductor Devices and IC's (ISPSD)\",\"volume\":\"102 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2017-05-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"6\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2017 29th International Symposium on Power Semiconductor Devices and IC's (ISPSD)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.23919/ISPSD.2017.7988966\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 29th International Symposium on Power Semiconductor Devices and IC's (ISPSD)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/ISPSD.2017.7988966","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 6

摘要

本文提出了一种新型的栅极连接屏蔽接触结构的LDMOS,不需要额外的掩模和工艺。TCAD模拟表明,该结构具有较低的电势和冲击电离。在实际硅上验证了Ron-sp/BVD比的降低和HCl SOA的显著改善。为了更好地控制过程,还研究了采用槽聚设计的新布局。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
A novel high-voltage LDMOS with shielding-contact structure for HCl SOA enhancement
This paper demonstrated a novel LDMOS with gate-connected shielding-contact structure, no extra mask or process is needed. TCAD simulation reveals lower electrical potential and impact ionization with the proposed structure. Ron-sp/BVD ratio reduction and significant HCl SOA improvement have been verified on real Silicon. Newly layout with Slot-Poly design has been investigated for better process control as well.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Message from the general chair Pressure contact multi-chip packaging of SiC Schottky diodes Experimental study of the short-circuit performance for a 600V normally-off p-gate GaN HEMT Design considerations of vertical GaN nanowire Schottky barrier diodes Chip-on-board assembly of 800V Si L-IGBTs for high performance ultra-compact LED drivers
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1