3D-MID for Space

2018 7th Electronic System-Integration Technology Conference (ESTC) Pub Date : 2018-09-01 DOI:10.1109/ESTC.2018.8546449

Dr. Etienne Hirt, Klaus Ruzicka

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引用次数: 3

摘要

空间应用需要高可靠性和低重量的系统。三维模压互连器件(3D-MID)工艺通过将(电子)封装与布线和机械结构相结合，具有满足要求的潜力。本文回顾了3D-MID技术，确定了最有前途的技术，并对测试车辆进行了调查，重点是ESA Artes 5.1计划中的空间使用情况。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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3D-MID for Space

Space applications demand highly reliable and low weight systems. Three-dimensional moulded interconnect device (3D-MID) processes have the potential to fulfil the requirements by combining the (electronic) packaging with routing and mechanical structure. In this paper 3D-MID technology is reviewed, most promising techniques identified and test vehicles are investigated with the focus on space usage within the ESA Artes 5.1 program.

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2018 7th Electronic System-Integration Technology Conference (ESTC)

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