用于5G应用的芯片嵌入式玻璃中介器

2023 IEEE Radio and Wireless Symposium (RWS) Pub Date : 2023-01-22 DOI:10.1109/RWS55624.2023.10046338

Xingchen Li, Xiaofan Jia, K. Moon, Joon Woo Kim, Aadit Pandey, A. Chiu, Andrew Kenerson, Madhavan Swaminathan

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摘要

本文介绍了一种针对5G应用的芯片嵌入式玻璃中介器的实现。通过建模、制造和测量，首次在5G频段上展示了中间插板上低损耗互连设计的两种方法。通过互连，制造的芯片嵌入式中间层可以实现40ghz以上的低损耗和宽带匹配。优异的性能证明了芯片嵌入式玻璃中间层是5G前端模块的一个有前途的封装解决方案。

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Chip-embedded Glass Interposer for 5G Applications

This paper presents the implementation of a chip-embedded glass interposer targeting 5G applications. Two approaches for low-loss interconnect design on the interposer are demonstrated for the first time on 5G bands by modeling, fabrication, and measurements. Enabled by the interconnects, the fabricated chip-embedded interposer performs low loss and wideband matching over 40 GHz. The excellent performance proves the chip-embedded glass interposer a promising package solution for 5G front-end modules.

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2023 IEEE Radio and Wireless Symposium (RWS)

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