S. Sarkar, V. Palazarri, G. Wang, N. Papageorgiou, D. Thompson, J. Lee, S. Pinel, M. Tentzeris, J. Papapolymerou, J. Laskar
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RF and mm-wave SOP module platform using LCP and RF MEMS technologies
In this paper, we present a Liquid Crystal Polymer (LCP) based multilayer packaging technology combined with RF-MEMS technology and its emergence as an ideal platform for low cost, multi-band and reconfigurable RF front-end module integration. LCP's very low water absorption (0.04%), low cost and high electrical performance makes it very appealing for RF applications. Here, we describe the characterization of LCP material up to W band, design of single input single output (SISO) dual band filters with insertion loss as low as 2.4 dB in L band and 1.8 dB in C band respectively. MEMS-SOP switch fabrication and finally integration of C band wireless LAN (WLAN) module demonstrates the potential for compact, multiband and reconfigurable systems. This is the first complete report on the combination of LCP with RF-MEMS technology as a new approach towards the System-On-Package (SOP) solutions for wireless communication applications.
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