电场依赖性AlGaN/GaN HEMT漏极电流漂移

Xinhua Wang, Yuan-qi Jiang, Sen Huang, Yingkui Zheng, K. Wei, Xiaojuan Chen, W. Luo, Guoguo Liu, L. Pang, T. Yuan, Xinyu Liu
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引用次数: 0

摘要

我们对GaN-on-SiC HEMT进行了恒压应力(CVS)测试,以研究漏极电流漂移。在CVS中观察到两种电流漂移行为。通过失态漏极电压阶跃应力试验验证了电场相关电流漂移。观察到漏极电流恢复的临界电压。我们认为漏极电流的恢复是由于异质结界面附近的空穴产生或势垒层中受体的脱陷。漏极电流漂移通过电流退化和恢复机制得到平衡。
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Electric field dependent drain current drift of AlGaN/GaN HEMT
We have performed constant voltage stress (CVS) tests on GaN-on-SiC HEMT to investigate the drain current drift. Two kinds of current drift behavior are observed in CVS. The off-state drain voltage step stress tests are carried out to confirm the electric field dependent current drift. A critical voltage for drain current recovery is observed. We suggest that the recovery of drain current is due to holes generation near the heterojunction interface or the detrapping of acceptors in the barrier layer. The drain current drift is balanced by the current degradation and recovery mechanism.
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