{"title":"基于多层ltcc的SiP应用的三维带状弯曲延迟线结构","authors":"Gawon Kim, A. Lu, Fan Wei, L. L. Wai, Joungho Kim","doi":"10.1109/ECTC.2008.4550271","DOIUrl":null,"url":null,"abstract":"Recently, the timing control of high-frequency signals is strongly demanded due to the high integration density in three-dimensional (3D) LTCC-based SiP applications. Therefore, to control the skew or timing delay, new 3D delay lines will be proposed. For frailty of the signal via, we adopt the concept of coaxial line and proposed an advanced signal via structure with quasi coaxial ground (QCOX-GND) vias. We will show the simulated results using EM and circuit simulator.","PeriodicalId":378788,"journal":{"name":"2008 58th Electronic Components and Technology Conference","volume":"75 6 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2008-05-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"15","resultStr":"{\"title\":\"3D strip meander delay line structure for multilayer LTCC-based SiP applications\",\"authors\":\"Gawon Kim, A. Lu, Fan Wei, L. L. Wai, Joungho Kim\",\"doi\":\"10.1109/ECTC.2008.4550271\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Recently, the timing control of high-frequency signals is strongly demanded due to the high integration density in three-dimensional (3D) LTCC-based SiP applications. Therefore, to control the skew or timing delay, new 3D delay lines will be proposed. For frailty of the signal via, we adopt the concept of coaxial line and proposed an advanced signal via structure with quasi coaxial ground (QCOX-GND) vias. We will show the simulated results using EM and circuit simulator.\",\"PeriodicalId\":378788,\"journal\":{\"name\":\"2008 58th Electronic Components and Technology Conference\",\"volume\":\"75 6 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2008-05-27\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"15\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2008 58th Electronic Components and Technology Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ECTC.2008.4550271\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2008 58th Electronic Components and Technology Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.2008.4550271","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
3D strip meander delay line structure for multilayer LTCC-based SiP applications
Recently, the timing control of high-frequency signals is strongly demanded due to the high integration density in three-dimensional (3D) LTCC-based SiP applications. Therefore, to control the skew or timing delay, new 3D delay lines will be proposed. For frailty of the signal via, we adopt the concept of coaxial line and proposed an advanced signal via structure with quasi coaxial ground (QCOX-GND) vias. We will show the simulated results using EM and circuit simulator.
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