使用TDT和TDRT进行开尔文晶圆测量和封装水平测试的VF-TLP系统

2004 Electrical Overstress/Electrostatic Discharge Symposium Pub Date : 2004-09-01 DOI:10.1109/EOSESD.2004.5272811

E. Grund, R. Gauthier

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引用次数: 33

摘要

文献中描述的超高速传输线脉冲(VF-TLP)系统是时域反射(VF-TDR)配置。使用其他TLP配置，VF-TLP系统可以提供新的功能。利用vf -时域传输技术(VF-TDT)建立了晶圆级开尔文探针系统。使用vf -时域反射和传输(VF-TDRT)的测试夹具板(TFB)可以实现VF-TLP封装级测试。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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VF-TLP systems using TDT and TDRT for kelvin wafer measurements and package level testing

Very fast transmission line pulse (VF-TLP) systems described in the literature are time domain reflection (VF-TDR) configurations. Using other TLP configurations, VF-TLP systems can provide new capabilities. A wafer level Kelvin probe system was derived from VF-time domain transmission (VF-TDT). A test fixture board (TFB) using VF-time domain reflection and transmission (VF-TDRT) enables VF-TLP package level testing.

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2004 Electrical Overstress/Electrostatic Discharge Symposium

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