100 GHz以上绝缘体衬底上微加工硅的SIMMWICs

A. Muller, E. Kasper
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引用次数: 2

摘要

介绍了频率在100ghz以上的硅毫米波集成电路(SIMMWICs)的实现。用分子束外延和低损耗微带线生长的外延层允许实现基本片上系统构建块所需的各种器件。使用Al/AlNiSi触点的应用硅技术提供了出色的集成可能性。肖特基二极管设计用于莫特模式操作,并具有超过700 GHz的截止频率。利用绝缘体硅(SOI)晶圆采用选择性蚀刻工艺制备了厚度为50 μ m的衬底膜。不同的微带电路设计展示了集成的潜力。最后,介绍了两种低功耗驱动和低转换损耗特性的单平衡混频器设计。我们选择122ghz ISM频段作为示例,以演示这种具有成本效益的集成方法的潜力。
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SIMMWICs on Micromachined Silicon on Insulator Substrates Beyond 100 GHz
The realization of SIMMWICs (silicon millimeter-wave integrated circuits) for frequencies above 100 GHz is presented. Epitaxial layers grown with molecular beam epitaxy and low-loss microstrip lines allow the implementation of a variety of devices required for basic system-on-chip building blocks. The applied silicon technology using Al/AlNiSi contacts offers excellent integration possibilities. Schottky diodes are designed for Mott mode operation and feature cutoff-frequencies of more than 700 GHz. Substrate membranes with a thickness of 50 mum are created by applying a selective etching process using silicon on insulator (SOI) wafers. Different microstrip circuit designs demonstrate the integration potential. Finally, two singly balanced mixer designs with low LO-power drive demands and low conversion loss characteristics are exposed. We choose the 122 GHz ISM band as an example for the demonstration of the potential of this cost-effective integration approach.
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