采用65nm CMOS工艺的超低漏电流无电阻电源轨ESD箝位电路

C. Yeh, M. Ker
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引用次数: 1

摘要

提出了一种以可控硅为主要ESD钳位器件,仅采用薄栅氧化物器件实现的无电阻电源轨ESD钳位电路,并在65nm 1V CMOS工艺上进行了验证。巧妙地利用栅极漏电流实现静电暂态检测电路中的等效电阻,可以在不使用实际电阻的情况下实现基于rc的静电暂态检测机制,从而减少I/O单元的布局面积。实验结果表明,在所设计的电源轨ESD箝位电路中,可控硅宽度为45μm的电源轨ESD箝位电路在ESD应力事件下可达到5kV HBM和400V MM的ESD水平,而在正常电路工作条件下,在25°C、1V偏置下,待机漏电流仅为1.43nA。
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Resistor-less power-rail ESD clamp circuit with ultra-low leakage current in 65nm CMOS process
A resistor-less power-rail ESD clamp circuit realized with only thin gate oxide devices, and with SCR as main ESD clamp device, has been proposed and verified in a 65nm 1V CMOS process. Skillfully utilizing the gate leakage currents to realize the equivalent resistors in the ESD-transient detection circuit, the RC-based ESD-transient detection mechanism can be achieved without using an actual resistor to reduce the layout area in I/O cells. From the measured results, the proposed power-rail ESD clamp circuit with SCR width of 45μm can achieve 5kV HBM and 400V MM ESD levels under the ESD stress event, while consuming only a standby leakage current of 1.43nA at 25°C under the normal circuit operating condition with 1V bias.
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Resistor-less power-rail ESD clamp circuit with ultra-low leakage current in 65nm CMOS process An age-aware library for reliability simulation of digital ICs Intrinsic study of current crowding and current density gradient effects on electromigration in BEOL copper interconnects Foundations for oxide breakdown compact modeling towards circuit-level simulations Making reliable memories in an unreliable world (invited)
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