{"title":"细节距金球键合优化","authors":"W.K. Shu","doi":"10.1109/IEMT.1993.398224","DOIUrl":null,"url":null,"abstract":"Response surface methodology is used to characterize a state-of-the-art wire bonder with a bottleneck capillary for fine pitch bonding. Regression analysis generates mathematical models to plot 3-D charts and contour charts of ball size and ball shear force as a function of wire bond parameters. A procedure is described to use contour charts to optimize bonding parameters. Bonding windows are identified by using bonding specification requirements and material/process constraints as boundary conditions.<<ETX>>","PeriodicalId":206206,"journal":{"name":"Proceedings of 15th IEEE/CHMT International Electronic Manufacturing Technology Symposium","volume":"1 2 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1993-10-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Fine pitch gold ball bonding optimization\",\"authors\":\"W.K. Shu\",\"doi\":\"10.1109/IEMT.1993.398224\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Response surface methodology is used to characterize a state-of-the-art wire bonder with a bottleneck capillary for fine pitch bonding. Regression analysis generates mathematical models to plot 3-D charts and contour charts of ball size and ball shear force as a function of wire bond parameters. A procedure is described to use contour charts to optimize bonding parameters. Bonding windows are identified by using bonding specification requirements and material/process constraints as boundary conditions.<<ETX>>\",\"PeriodicalId\":206206,\"journal\":{\"name\":\"Proceedings of 15th IEEE/CHMT International Electronic Manufacturing Technology Symposium\",\"volume\":\"1 2 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1993-10-04\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of 15th IEEE/CHMT International Electronic Manufacturing Technology Symposium\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IEMT.1993.398224\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of 15th IEEE/CHMT International Electronic Manufacturing Technology Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEMT.1993.398224","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Response surface methodology is used to characterize a state-of-the-art wire bonder with a bottleneck capillary for fine pitch bonding. Regression analysis generates mathematical models to plot 3-D charts and contour charts of ball size and ball shear force as a function of wire bond parameters. A procedure is described to use contour charts to optimize bonding parameters. Bonding windows are identified by using bonding specification requirements and material/process constraints as boundary conditions.<>
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