先进的空间真空III-V材料加工

A. Ignatiev, C. Horton, M. Sterling, R. Sega, A. Bensaoula, A. Freundlich, S. Pei
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引用次数: 2

摘要

采用分子束外延(MBE)技术,在低地球轨道(LEO)的超真空环境中制备了掺杂和未掺杂的砷化镓薄膜。WSF是一个直径12英尺的不锈钢圆盘,可以扫出一定体积的空间,从而在其尾迹中产生超真空。它是专门为利用超真空沉积薄膜材料而开发的。WSF于1994年2月首次在STS-60上飞行。任务目标是测量尾流屏蔽形成的独特的尾流真空环境,并外延沉积GaAs薄膜。在本文中,我们描述了沉积的薄膜,并报告了迄今为止所进行的表征。薄膜沉积成两种基本结构。第一种结构由厚度为2 ~ 4 /spl μ m的未掺杂GaAs薄膜组成,薄膜上有薄层(/spl μ m /200 mn)高硅掺杂层(n/spl μ m /5/spl倍/10/sup 17//cc)。这基本上是一个金属半导体场效应晶体管(MESFET)结构。第二种结构是轻硅掺杂的GaAs膜(n/spl /5/spl × /10/sup / 15//cc)。我们获得了所选薄膜的光致发光(PL)、二次离子质谱(SIMS)和x射线衍射数据。数据表明,标称质量单晶膜与氧和碳污染。讨论了污染的来源和进一步的表征。
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Advanced III-V materials processing in the vacuum of space
GaAs films, both silicon doped and undoped, have been deposited by Molecular Beam Epitaxy (MBE) in Low Earth Orbit (LEO) in an ultra vacuum environment created by the Wake Shield Facility (WSF). The WSF is a 12 foot diameter stainless steel disk that sweeps out a volume of space thus creating an ultra vacuum in its wake. It was developed specifically to take advantage of the ultra vacuum for the deposition of thin film materials. The WSF was flown for the first time on STS-60 in February, 1994. The mission objectives were to measure the unique wake vacuum environment formed by the Wake Shield, and to epitaxially deposit GaAs thin films. In this paper we describe the films deposited and report on the characterization performed to date. Films were deposited in two basic structures. The first structure consisted of undoped GaAs films of thicknesses ranging from 2 to 4 /spl mu/m with a thin (/spl ap/200 mn) highly silicon doped layer (n/spl ap/5/spl times/10/sup 17//cc) on top. This is basically a metal-semiconductor field effect transistor (MESFET) structure. The second structure was a lightly silicon doped GaAs film (n/spl ap/5/spl times/10/sup 15//cc). We have obtained Photoluminescence (PL), Secondary Ion Mass Spectrometry (SIMS) and X-Ray diffraction data on selected films. The data indicate nominal quality single crystal films with oxygen and carbon contamination. The source of the contamination and further characterization are discussed.
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