先进的片上多晶硅CMOS模拟和驱动电路技术,用于智能离散器件

T. Matsudai, T. Kojima, A. Nakagawa
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引用次数: 0

摘要

本文研究了在热氧化膜上制备的0.8 /spl μ m栅极长多晶硅CMOS的模拟电路和驱动电路的性能。重点介绍了负载短路保护电路和高侧驱动电路的性能。首次发现改进的多晶硅模拟电路工作速度足够快,可以保护高压电源器件。实验证实,该多晶硅电路可在200nsec内驱动20 a /600 V大功率IGBT,并能安全保护负载不发生短路故障。实验还表明,带电荷泵的多晶硅高侧驱动电路在130 /spl mu/sec内成功地导通了25 a /60 V MOSFET。
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Advanced on-chip polysilicon CMOS analog and driver circuit technology for intelligent discrete devices
In this paper, we investigate the analog and driver circuit performances of 0.8 /spl mu/m gate length polysilicon CMOS fabricated on a thermal oxide film. Especially, we report the capability of load short-circuit protection circuit and high-side driver circuit. For the first time, it is found that the improved polysilicon analog circuits works sufficiently rapidly to protect high voltage power devices. It was experimentally confirmed that a 20 A/600 V high power IGBT can be driven and safely protected from load short-circuit failure by the polysilicon circuits within 200 nsec. It was also shown that a polysilicon high-side driver circuit with a charge pump successfully switched on a 25 A/60 V MOSFET within 130 /spl mu/sec.
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