Chia-Cheng Chang, Hung-Te Yang, Yen-Fu Su, Yu-Ting Hong, K. Chiang
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A method to compensate packaging effects on three-axis MEMS accelerometer
This paper discusses about the residual stress and packaging effect of three-axis micro-electro-mechanical system (MEMS) accelerometer. The 3D FEM model with modal analysis method is adopted for the resonance frequency estimation. This paper also presents a simple compensation model for trimming the offset of capacitance differentiation using the measured resonance frequency. This trimmming methodology can be realized by adjusting circuit gain in real product.
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