有机包装集成NFC恶劣环境

2018 7th Electronic System-Integration Technology Conference (ESTC) Pub Date : 2018-09-01 DOI:10.1109/ESTC.2018.8546424

Sven Johannsen, E. Bihler, M. Hauer

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引用次数: 0

摘要

液晶聚合物(Liquid Crystal Polymer, LCP)是一种热塑性介质材料，具有优异的材料性能，既可以作为衬底材料，也可以作为小型微型化电子封装和模块的封装材料。通过将NFC线圈集成到LCP基板中，可以获得非常小的外形因素。LCP的封装可以为医疗、工业和汽车市场的传感器应用提供密封和化学惰性的小型化电子模块。

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Organic packaging with integrated NFC for harsh environments

Liquid Crystal Polymer (LCP), a thermoplastic dielectric material with superior material properties can be used both as the substrate material and as the encapsulation for small miniaturized electronic packages and modules. Very small form factors can be obtained by integrating the NFC coil into the LCP substrate. Encapsulation in LCP can provide hermetically sealed and chemically inert miniaturized electronic modules for sensors applications in medical, industrial and automotive markets.

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2018 7th Electronic System-Integration Technology Conference (ESTC)

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