{"title":"通过创新的解决方案优化NGSHBI的吞吐量","authors":"N. Annamalai, Choo Pak Kee, K. S. Yeoh, W. Ismail","doi":"10.1109/IEMT.2008.5507850","DOIUrl":null,"url":null,"abstract":"Productivity and cost savings are known key challenges in this competitive semiconductor industries. It has become more complex with the introduction of a new equipment, NGSHBI (Next Generation Self Heat Burn-In) integration into Test Operation. NGSHBI module was developed and deployed to support the product for Burn In requirement for chipset product. Moving into high product mix environment, the team encountered complexities with different package size design interception. With this multi form factor requirement, the design team provided fungible kit solution with new actuation bar design. The solution was not effective and also not factory friendly. This paper will outline how the key unproductive line item has been narrowed and solved through innovative solution","PeriodicalId":151085,"journal":{"name":"2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT)","volume":"97 1-2","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2008-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"NGSHBI throughput optimization through innovative solution\",\"authors\":\"N. Annamalai, Choo Pak Kee, K. S. Yeoh, W. Ismail\",\"doi\":\"10.1109/IEMT.2008.5507850\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Productivity and cost savings are known key challenges in this competitive semiconductor industries. It has become more complex with the introduction of a new equipment, NGSHBI (Next Generation Self Heat Burn-In) integration into Test Operation. NGSHBI module was developed and deployed to support the product for Burn In requirement for chipset product. Moving into high product mix environment, the team encountered complexities with different package size design interception. With this multi form factor requirement, the design team provided fungible kit solution with new actuation bar design. The solution was not effective and also not factory friendly. This paper will outline how the key unproductive line item has been narrowed and solved through innovative solution\",\"PeriodicalId\":151085,\"journal\":{\"name\":\"2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT)\",\"volume\":\"97 1-2\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2008-11-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IEMT.2008.5507850\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEMT.2008.5507850","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
NGSHBI throughput optimization through innovative solution
Productivity and cost savings are known key challenges in this competitive semiconductor industries. It has become more complex with the introduction of a new equipment, NGSHBI (Next Generation Self Heat Burn-In) integration into Test Operation. NGSHBI module was developed and deployed to support the product for Burn In requirement for chipset product. Moving into high product mix environment, the team encountered complexities with different package size design interception. With this multi form factor requirement, the design team provided fungible kit solution with new actuation bar design. The solution was not effective and also not factory friendly. This paper will outline how the key unproductive line item has been narrowed and solved through innovative solution
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