{"title":"用于射频应用的低应力酸酐成型化合物","authors":"P. Procter, T. R. Miles","doi":"10.1109/IWIPP.2000.885187","DOIUrl":null,"url":null,"abstract":"Anhydride cured epoxy molding compounds offer inherently high glass transition temperature (T/sub g/), high adhesion and low dielectric constant at a moderate cost. However, historical drawbacks of anhydride-cured compounds (poor moldability and moisture resistance, high coefficient of thermal expansion, shrinkage and brittleness) have limited their use for surface mount applications. This paper details the development of new anhydride compounds designed specifically for surface mount power applications.","PeriodicalId":359131,"journal":{"name":"IWIPP 2000. International Workshop on Integrated Power Packaging (Cat. No.00EX426)","volume":"306 7","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2000-07-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Low stress anhydride molding compound for RF applications\",\"authors\":\"P. Procter, T. R. Miles\",\"doi\":\"10.1109/IWIPP.2000.885187\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Anhydride cured epoxy molding compounds offer inherently high glass transition temperature (T/sub g/), high adhesion and low dielectric constant at a moderate cost. However, historical drawbacks of anhydride-cured compounds (poor moldability and moisture resistance, high coefficient of thermal expansion, shrinkage and brittleness) have limited their use for surface mount applications. This paper details the development of new anhydride compounds designed specifically for surface mount power applications.\",\"PeriodicalId\":359131,\"journal\":{\"name\":\"IWIPP 2000. International Workshop on Integrated Power Packaging (Cat. No.00EX426)\",\"volume\":\"306 7\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2000-07-14\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IWIPP 2000. International Workshop on Integrated Power Packaging (Cat. No.00EX426)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IWIPP.2000.885187\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IWIPP 2000. International Workshop on Integrated Power Packaging (Cat. No.00EX426)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IWIPP.2000.885187","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Low stress anhydride molding compound for RF applications
Anhydride cured epoxy molding compounds offer inherently high glass transition temperature (T/sub g/), high adhesion and low dielectric constant at a moderate cost. However, historical drawbacks of anhydride-cured compounds (poor moldability and moisture resistance, high coefficient of thermal expansion, shrinkage and brittleness) have limited their use for surface mount applications. This paper details the development of new anhydride compounds designed specifically for surface mount power applications.
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