{"title":"无线射频模块集成无源器件技术的比较与分析","authors":"A. Kundu, M. Megahed, D. Schmidt","doi":"10.1109/ECTC.2008.4550046","DOIUrl":null,"url":null,"abstract":"We have investigated the existing integrated passive device (IPD) technologies for cost effective IPD solutions for discrete radio frequency (RF) module. Based upon the investigation in terms of cost, size, performance & technology maturity, it comes out that silicon, glass & LTCC are the suitable technologies. We have designed IPDs using these technologies having same foot print to satisfy Intel Wi-MAX specs. Have taped out, validated the samples and made an electrical performance and cost comparison among three technologies. Result shows that Si_IPD & Glass_IPD both have well enough electrical performance required for Wi_MAX solution at lower cost and equivalent size compared to LTCC.","PeriodicalId":378788,"journal":{"name":"2008 58th Electronic Components and Technology Conference","volume":"12 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2008-05-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"28","resultStr":"{\"title\":\"Comparison and analysis of integrated passive device technologies for wireless radio frequency module\",\"authors\":\"A. Kundu, M. Megahed, D. Schmidt\",\"doi\":\"10.1109/ECTC.2008.4550046\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We have investigated the existing integrated passive device (IPD) technologies for cost effective IPD solutions for discrete radio frequency (RF) module. Based upon the investigation in terms of cost, size, performance & technology maturity, it comes out that silicon, glass & LTCC are the suitable technologies. We have designed IPDs using these technologies having same foot print to satisfy Intel Wi-MAX specs. Have taped out, validated the samples and made an electrical performance and cost comparison among three technologies. Result shows that Si_IPD & Glass_IPD both have well enough electrical performance required for Wi_MAX solution at lower cost and equivalent size compared to LTCC.\",\"PeriodicalId\":378788,\"journal\":{\"name\":\"2008 58th Electronic Components and Technology Conference\",\"volume\":\"12 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2008-05-27\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"28\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2008 58th Electronic Components and Technology Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ECTC.2008.4550046\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2008 58th Electronic Components and Technology Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.2008.4550046","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Comparison and analysis of integrated passive device technologies for wireless radio frequency module
We have investigated the existing integrated passive device (IPD) technologies for cost effective IPD solutions for discrete radio frequency (RF) module. Based upon the investigation in terms of cost, size, performance & technology maturity, it comes out that silicon, glass & LTCC are the suitable technologies. We have designed IPDs using these technologies having same foot print to satisfy Intel Wi-MAX specs. Have taped out, validated the samples and made an electrical performance and cost comparison among three technologies. Result shows that Si_IPD & Glass_IPD both have well enough electrical performance required for Wi_MAX solution at lower cost and equivalent size compared to LTCC.
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