{"title":"AI-FDC:全晶圆厂制程设备健康监测自动化自顶向下系统","authors":"Richard Burch, M. Keleher, Kazuki Kunitoshi","doi":"10.1109/ISSM51728.2020.9377500","DOIUrl":null,"url":null,"abstract":"We have developed a novel technique to handle Fault Detection and Classification data for Equipment Health Monitoring. While most techniques are very human intensive, this AI-FDC technique allows for less human interaction by taking advantage of recent advancements in Machine Learning. Raw traces are automatically broken down into windows with consistent characteristics, relevant statistics are automatically calculated based on window characteristics, and anomalous traces are detected by the system without labels. This system will accelerate root cause diagnosis of Equipment Breakdowns and prevent subsequent breakdowns.","PeriodicalId":270309,"journal":{"name":"2020 International Symposium on Semiconductor Manufacturing (ISSM)","volume":"99 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2020-12-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"AI-FDC: Automated Top Down System for Fab Wide Process Equipment Health Monitoring\",\"authors\":\"Richard Burch, M. Keleher, Kazuki Kunitoshi\",\"doi\":\"10.1109/ISSM51728.2020.9377500\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We have developed a novel technique to handle Fault Detection and Classification data for Equipment Health Monitoring. While most techniques are very human intensive, this AI-FDC technique allows for less human interaction by taking advantage of recent advancements in Machine Learning. Raw traces are automatically broken down into windows with consistent characteristics, relevant statistics are automatically calculated based on window characteristics, and anomalous traces are detected by the system without labels. This system will accelerate root cause diagnosis of Equipment Breakdowns and prevent subsequent breakdowns.\",\"PeriodicalId\":270309,\"journal\":{\"name\":\"2020 International Symposium on Semiconductor Manufacturing (ISSM)\",\"volume\":\"99 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2020-12-15\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2020 International Symposium on Semiconductor Manufacturing (ISSM)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISSM51728.2020.9377500\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 International Symposium on Semiconductor Manufacturing (ISSM)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISSM51728.2020.9377500","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
AI-FDC: Automated Top Down System for Fab Wide Process Equipment Health Monitoring
We have developed a novel technique to handle Fault Detection and Classification data for Equipment Health Monitoring. While most techniques are very human intensive, this AI-FDC technique allows for less human interaction by taking advantage of recent advancements in Machine Learning. Raw traces are automatically broken down into windows with consistent characteristics, relevant statistics are automatically calculated based on window characteristics, and anomalous traces are detected by the system without labels. This system will accelerate root cause diagnosis of Equipment Breakdowns and prevent subsequent breakdowns.