硅酮用量对大功率LED加速应力测试流明维持的影响研究

Qi Chen, Run Hu, Bin Xie, Yue Xingjian, Jingjing Cheng, Xiaobing Luo
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引用次数: 2

摘要

在我们之前的研究中,我们通过高加速应力测试(HAST)研究了不同封装材料(硅树脂和荧光粉层)对大功率发光二极管(HPLEDs)可靠性的影响。实验结果表明,LED样品的流明维持性能可能与封装中硅酮的用量有关。在本文中,我们进一步研究了有机硅用量对腔腔维持的影响。制备了按硅酮量指定的5类LED样品,并将其置于温度为125℃的等温室中。利用在线测试系统对实验过程中的光输出进行实时监测和记录。时效400 h后,最大衰减幅度为6.17%,不同组表现出不同的降解行为。采用指数衰减模型计算各管腔维持曲线的衰减率。衰减率随封装模块内硅胶量的变化而变化。这一现象得到了很好的解释,并进行了蒙特卡罗光线追踪模拟来验证这一解释。还发现了硅酮用量与温度的交互作用,需要进一步研究。
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Effect study of silicone amount on the lumen maintenance of high power LED under accelerated stress test
In our previous study, we investigated the effects of different packaging materials (silicone and phosphor layer) on the reliability of high power light-emitting diodes (HPLEDs) by highly accelerated stress test (HAST). The experimental results showed that the LED samples' lumen maintenance property might have dependence on the silicone amount in the package. In this paper, we further studied the effect of silicone amount on the lumen maintenance under HAST. Five categories of LED specimens specified by silicone amount were prepared and subjected to an isothermal chamber whose temperature was set at 125 °C. An online testing system was used to monitor and record the light outputs in real time during the experimental process. After 400 hours of aging, the largest attenuating range reached 6.17% and different groups display different degradation behaviors. An exponential decay model was adopted to calculate the decay rate of each lumen maintenance curve. The decay rate differs as the silicone amount inside the package modules changes. This phenomenon is well explained and Monte Carlo ray-tracing simulations are carried out to validate the explanation. The interaction effect of both silicone amount and temperature is also found and more researches need to be done for further study.
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