Kai Fu, Jin-Wei Pan, Jing Jin, Wensheng Zhao, Gaofeng Wang
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The impact of current return path on the signal propagation in the through-silicon via array
Through-silicon via (TSV)-to-TSV coupling is a critical challenge of 3-D ICs, and, it is quite different from the coupling issues of on-chip interconnects. In this paper, the traditional TSV-to-TSV coupling model is restated and modified. The current return path, i.e., ground TSV, is considered. Then, the impacts of circuit elements on the coupling coefficient are analyzed based on the circuit model.
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