双搭接胶粘接的拓扑优化

S. Kurennov, K. Barakhov, Olexander Polyakov
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引用次数: 0

摘要

研究了对称双搭接接头的优化设计问题。假设主板的厚度是恒定的,而贴片的厚度可以沿着节点的长度变化。优化问题是在存在强度约束的情况下,找到提供最小结构质量的关节的最佳长度和贴片的最佳轮廓。采用经典的Goland-Reissner模型来描述接头的应力状态。用有限差分法求解了相应的变系数微分方程组。对于优化问题的数值求解,采用了遗传优化算法。解决了一个模型问题。
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Topological Optimization of the Double-Lap Adhesive Joint
The problem of optimal design of a symmetrical double-lap adhesive joint is considered. It is assumed that the main plate has a constant thickness, while the thickness of the patchs can vary along the length of the joint. The optimization problem is to find the optimal length of the joint and the optimal profile of the patches, which provide a minimum mass of the structure in the presence of strength constraints. The classical Goland-Reissner model was used to describe the stress state of the joint. The corresponding system of differential equations with variable coefficients is solved using the finite difference method. For the numerical solution of the optimization problem, a genetic optimization algorithm was used. One model problem are solved.
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