探索片上混合光子网络-融合片上多处理器

Shirish Bahirat, S. Pasricha
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引用次数: 29

摘要

随着应用程序复杂性的增加和工艺技术的改进,如今的芯片多处理器(cmp)在一个芯片上拥有数十到数百个内核。片上网络(noc)已经成为可扩展的通信结构,可以支持这些大规模并行系统的高带宽。然而,传统的电气NoC实现仍然需要克服高数据传输延迟和大功耗的挑战。片上光子互连最近被提出作为解决这些挑战的替代方案,具有芯片内通信的高每瓦性能特性。在本文中,我们探索了在芯片上使用光子互连来增强传统的电子noc。我们提出的混合光子NoC利用光子环形波导来增强传统的二维电网格NoC。实验结果表明,在未来的cmp中考虑混合光子NoC的强烈动机-与传统的电二维网格和环面NoC架构相比,功耗降低了13倍,吞吐量和访问延迟提高了。
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Exploring hybrid photonic networks-on-chip foremerging chip multiprocessors
Increasing application complexity and improvements in process technology have today enabled chip multiprocessors (CMPs) with tens to hundreds of cores on a chip. Networks on Chip (NoCs) have emerged as scalable communication fabrics that can support high bandwidths for these massively parallel systems. However, traditional electrical NoC implementations still need to overcome the challenges of high data transfer latencies and large power consumption. On-chip photonic interconnects have recently been proposed as an alternative to address these challenges, with high performance-per-watt characteristics for intra-chip communication. In this paper, we explore using photonic interconnects on a chip to enhance traditional electrical NoCs. Our proposed hybrid photonic NoC utilizes a photonic ring waveguide to enhance a traditional 2D electrical mesh NoC. Experimental results indicate a strong motivation for considering the proposed hybrid photonic NoC for future CMPs -- as much as a 13× reduction in power consumption and improved throughput and access latencies, compared to traditional electrical 2D mesh and torus NoC architectures.
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