利用GaN中的低频噪声测量评估栅极应力对Si hemt的影响

M. Masuda, D. Derickson, T. Weatherford, M. Porter
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引用次数: 0

摘要

测量了在栅极施加电场应力前后GaN-on-Si高电子迁移率晶体管(HEMTs)漏极和栅极电流低频噪声(LFN)谱的变化。提取的Hooge参数与前人的研究结果一致。发现器件应力后的1/f谱上叠加有RTS噪声谱。RTS光谱的时间常数在温度和电压范围内表征。发现RTS噪声时间常数随In(τrts)∝1/kT而变化,从而可以计算出陷阱的活化能。讨论了由场相关应力引起的降解过程中导致RTS谱变化的电子捕获机制。
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Effects of gate stress evaluated using low frequency noise measurements in GaN on Si HEMTs
Change in the drain and gate current low frequency noise (LFN) spectra of GaN-on-Si high electron mobility transistors (HEMTs) is measured before and after the application of electric field stressing on the gate. Extracted Hooge parameters are found to be consistent with previous research. RTS noise spectra are found to appear superimposed upon the 1/f spectrum after device stress. Time constants of the RTS spectra are characterized over a range of temperatures and voltages. It is found that RTS noise time constants change with In(τrts) ∝ 1/kT allowing trap activation energies to be calculated. Electron trapping mechanisms responsible for the modification of the RTS spectra are discussed in connection with degradation processes induced by field dependent stressing.
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