场发射材料碳化铪薄膜的STM观测

T. Sato, M. Saida, K. Horikawa, M. Nagao, S. Kanemaru, T. Matsukawa, J. Itoh, S. Yamamoto, M. Sasaki
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引用次数: 0

摘要

我们用扫描隧道显微镜(STM)研究了功函数和形貌的微观行为。在0.1 Pa的氩气压力下,采用电感耦合等离子体(ICP)辅助磁控溅射技术在n型Si平面衬底上沉积了碳化铪薄膜。在STM观察之前,用原位氩离子溅射对薄膜表面进行了清洗。离子电流、持续时间和加速电压分别设定为3.0 /spl mu/A、10 min和0.5 keV或1.0 keV。利用STM装置获得的局部隧道势垒高度(LBH)计算了微观功函数分布。我们采用尖端调制方法来评估LBH,可以同时获得地形和LBH图像。我们还用开尔文探针测量了这些样品表面的宏观功函数。1.0 keV溅射表面的功函数比0.5 keV溅射表面的功高0.4 eV。
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STM observations of hafnium carbide thin films as a field emission material
We examine microscopic behaviors of work function and topography with scanning tunneling microscopy (STM). Hafnium carbide thin films were deposited on an n-type Si flat substrate by inductively coupled plasma (ICP) assisted magnetron sputtering at the argon pressure of 0.1 Pa. The surface of the films was cleaned by in-situ argon ion sputtering before STM observations. The ion current, duration and acceleration voltage were set at 3.0 /spl mu/A, 10 min, and 0.5 keV or 1.0 keV, respectively. The microscopic work function distribution was evaluated from the local tunneling barrier height (LBH) obtained with an STM apparatus. We adopted the tip-modulation method to evaluate LBH where we can obtain topograph and LBH images simultaneously. We also measured the macroscopic work function of these sample surfaces by a Kelvin probe. The work function of the 1.0 keV sputtered surface is 0.4 eV higher than that of the 0.5 keV sputtered surface.
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