{"title":"聚酰亚胺粘附特性","authors":"R. Narechania, J. Bruce, Cherie A. Beach","doi":"10.1109/IRPS.1984.362048","DOIUrl":null,"url":null,"abstract":"The effects of surface treatment and cure temperatures on polyimide to silicon nitride adhesion strength are discussed. Results show the importance of surface cleanliness and the requirements for an adhesion promoter. Understanding the temperature cure to a polyimide adhesion strength at a nitride interface is also important.","PeriodicalId":326004,"journal":{"name":"22nd International Reliability Physics Symposium","volume":"55 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1984-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Polyimide Adhesion Characteristics\",\"authors\":\"R. Narechania, J. Bruce, Cherie A. Beach\",\"doi\":\"10.1109/IRPS.1984.362048\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The effects of surface treatment and cure temperatures on polyimide to silicon nitride adhesion strength are discussed. Results show the importance of surface cleanliness and the requirements for an adhesion promoter. Understanding the temperature cure to a polyimide adhesion strength at a nitride interface is also important.\",\"PeriodicalId\":326004,\"journal\":{\"name\":\"22nd International Reliability Physics Symposium\",\"volume\":\"55 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1984-04-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"22nd International Reliability Physics Symposium\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IRPS.1984.362048\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"22nd International Reliability Physics Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IRPS.1984.362048","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
The effects of surface treatment and cure temperatures on polyimide to silicon nitride adhesion strength are discussed. Results show the importance of surface cleanliness and the requirements for an adhesion promoter. Understanding the temperature cure to a polyimide adhesion strength at a nitride interface is also important.
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