金属层光刻返工引起氧化膜脱层后氮化钛膜表面形貌的变化

H. T. Chiew, Jacqueline Tan, Selinda Lim, K. S. Lee, L. Y. Ren, B. C. Lee, P. S. Quek, K. S. Pey
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引用次数: 1

摘要

典型的光刻返工过程包括一个抗蚀剂湿带,然后是一个干带。研究发现,在返工路线中,脱层现象与较长的下降时间有关。脱层假设表明,经过脱层处理后,TiN的表面粗糙度发生了变化。这一假设得到了各种实验的支持。TiN表面形貌由柱状结构转变为刺状突起。TiN的电阻率随沉降时间的增加而增加。优化金属层光刻返工过程中的脱落时间,使TiN表面更加光滑,消除了脱层问题。本文还讨论了这一效应的机理
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Surface Morphology Change of Titanium Nitride Film after Metal Layer Photolithography Rework Causing Oxide Film De-lamination
Typical photolithography rework process involves a resist wet strip following by a dry descum process. It is found that the de-lamination phenomena correlate to longer descum timing in the rework route. Hypothesis of the de-lamination suggests a change in the surface roughness of TiN after being subjected to descum process. This hypothesis is supported by various experiments conducted. Surface morphology of TiN changes from columnar structure to thorn shape protuberance. The sheet resistivity of TiN is also increased with increase of descum time. Optimization of the descum time during metal layer photolithography rework makes the surface of TiN smoother and it eliminates the de-lamination issue. The mechanism of this effect is also discussed in this paper
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