statpep -电力电子封装的现状-方法学

APEC '99. Fourteenth Annual Applied Power Electronics Conference and Exposition. 1999 Conference Proceedings (Cat. No.99CH36285) Pub Date : 1999-03-14 DOI:10.1109/APEC.1999.749484

M. Meinhardt, A. Alderman, J. Flannery, P. Cheasty, S. Eckert, C. Mathuna

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引用次数: 6

摘要

本文介绍了用于商用DC/DC和AC/DC开关模式电源的电力电子封装(STATPEP)现状的动机、方法和初步结果。根据目前的现状和对过去5到10年PEP发展的了解，绘制了经验曲线，显示了未来电源PEP的预期趋势。STATPEP项目由PSMA和参与公司共同赞助。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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STATPEP-current status of power electronic packaging for power supplies-methodology

The paper shows the motivation, methodology and early results of a review of the status of power electronic packaging (STATPEP) used in commercial DC/DCand AC/DC-switch mode power supplies. Based on the current status and the knowledge about the development of PEP over the last 5 to 10 years experience curves are developed which show the expected trends in PEP of power supplies for the future. The STATPEP project is being co-sponsored by the PSMA and participating companies.

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APEC '99. Fourteenth Annual Applied Power Electronics Conference and Exposition. 1999 Conference Proceedings (Cat. No.99CH36285)

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