用于个人计算机的VLSI芯片组

T. Machida, T. Matsuda, F. Tsukuda, R. Hashishita
{"title":"用于个人计算机的VLSI芯片组","authors":"T. Machida, T. Matsuda, F. Tsukuda, R. Hashishita","doi":"10.1109/VLSIC.1988.1037411","DOIUrl":null,"url":null,"abstract":"This paper will describe a V U 1 chip-set for Personal Computers. It consists of Peripheral Controller (PERIJ made of I1 standard peripheral mega-macro block, Text Controller (CRZT), and Graphics Controller (CRTG). The chips fully utilize hierarchical automatic layout design system. 205K transistors have been integrated by a three chip-set. They have been fabricated by I.5pm double metal-layer CMOS process technology. The chip-set allows to design a personal computer of M-size with CPU, memory and some inteqace logics. The personal computer consumes only 114 of power. compared to a standard version with the same system configuration. Introduction : This paper describes a VLSI chip-set for Personal Computers. The set consists of Peripheral Controller (PERI), Text Controller (CRm), and Graphics Controller bus and address bus. Bus controller gives bus interface Control signals, such as memory readlwrite and I10 readwrite, to mega-macro blocks. Custom-macro blocks are provided to realize user-defined functions, such as timing control of the device, extemal interface, offchip memory interface, and so on. Standard cell approach realizes these custom-macros. Microphotograph of the chip is shown in Fig.3. The CRTT contains a Graphic Display Controller (GDC) mega-macro and 5.4K-gate custom-macro.The CRTG contains a GDC and 11 .5K-gate custom-macro. Table 1 summarizes features of three chips. Fig.4 shows an example of PC system configuration by the chip-set. As is shown, only the interface logics are required, in addition to ROM/RAM and CPU. Mega-Macro Blocks : The mega-macro blocks are the (CKIti). A VLSI chip-set which integrates various standard peripheral LSIs is highly required by system vendors so that a small system with low Power consumption can be realized. In this case, the chip-set should be software-compatible with the off-the-shelf standard peripheral LSIs, and should be developedin shortperiod. A simple way of implementing such VLSIs without modifying the original LSIS tends to have enormous chip area. Entirely new design of standard LSI by another technology, such as standard cell approach, also has enormous man-power to modify existing standard LSI circuit for standard cell. mozified versions of standard m&roprocessor peripheral controllers. Features of mega-macros are shown in Table 2. Use of a mega-macro block reduces the number of transistors and area size, compared to the standard cell approach. For example, the PI0 mega-macro block has 2,500 transistors, however it would have 4,400 transistors if it were designed by using standard cell technique. In the PERI-chip case, this technique has reduced 37% of total chip size than the standard cell design. The original layout of standard LSIs were used as first approximation of mega-macro blocks, then VO pads were stripped out to have the smallest block area. It has brought 25% to 54% of area reduction, compared to ones with The chip-set has been developed to fulfill these I/O Dads. The oumut drivers of each mega-macro block has requirements by utilizing following techniques: * Peripheral megamacro block made of standard LSI * Hierarchical automatic design system * Double metal-layer 1.5pn CMOS process technology Use of standard LSI as the base of mega-macro block as well as automatic layout system has reduced man-vower. comoared beeiredesigned tobe able to drive the intehal common-bus. Process Conversion : BC and DMAC in the PERI chip have been redesigned for mega-macro implementation in order to unify the process technology. The double metal-layer Drocess technoloev. which can be easilv transferred from the IO manual implkmentstion. Double metal-lay& technology also realized reasonable chip size, although original LSIs were briginal single &&-layer pmcess. was ;mployed to utiliic the original lsyout design. realized by single metal-layer technolog< The process technology also enables high design flexibility of automatic layout design, maintaining original LSIs performance. The chip-set has been fabricated by 1.5pm double metal layer CMOS technology and approximately 205K transistors have been integrated in the chip-set. It has eight peripherals functions, and has realized 114 of power consumption than the standard LSI based system. Chip-Set Structure : Chip-set structure is shown in Fig.1. Each chip contains two different types of blocks: mega-macro blocks and custom-macro blocks. The P E N chip has eleven mega-macro blocks in seven types. They are: Floppy Disk Controller (FDC), 8-level pn’ority Intempt Controller (PIC), 4-channel 8-biUldbit DMA Controller (DMAC), 3-channel 16-bit Timer (TIM), Bus Controller (BC), SynchronousIAsynchronous Serial 110 Controller (SIO). and triple byte-wise Parallel YO Controller (PIO). In addition, it has 5K-gate custom-macro to implement other functions. Block diagram is shown in Fig.2. In the chip, mega-macro blocks are interconnected through the intemal data . Automatic Design : The chip-set was designed by using hierarchical automatic layout system. Three automatic layout programs were employed in this system. Poly-Cell Layout Program designs custom-macro blocks. Hierarchical layout design of the chip requires layout programs to place and interconnect various macro blocks in different sizes and shapes. Floor Planner and Building Block Layout Program has been applied to placements and interconnections of macro blocks,respectively. Fig. 5 shows this layout system and design flow. First, the Floor Planner does macro block placements prior to the actual design of each custom-macro block. It tries to place macro blocks in smallest area by determining the size, aspect ratio, and terminal positions of each custom-macro block. Once the floor plan is decided, custom-macro blocks are laid out according to the result of floor plan. Then, custom-macro blocks, mega-macro blocks, and VO blocks are interconnected by the Building Block Layout Program. This process is iterated in short TAT (turn-around time), until optimal layout is achieved.This automatic approach has brought","PeriodicalId":115887,"journal":{"name":"Symposium 1988 on VLSI Circuits","volume":"85 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"VLSI chip-set for personal computers\",\"authors\":\"T. Machida, T. Matsuda, F. Tsukuda, R. 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Bus controller gives bus interface Control signals, such as memory readlwrite and I10 readwrite, to mega-macro blocks. Custom-macro blocks are provided to realize user-defined functions, such as timing control of the device, extemal interface, offchip memory interface, and so on. Standard cell approach realizes these custom-macros. Microphotograph of the chip is shown in Fig.3. The CRTT contains a Graphic Display Controller (GDC) mega-macro and 5.4K-gate custom-macro.The CRTG contains a GDC and 11 .5K-gate custom-macro. Table 1 summarizes features of three chips. Fig.4 shows an example of PC system configuration by the chip-set. As is shown, only the interface logics are required, in addition to ROM/RAM and CPU. Mega-Macro Blocks : The mega-macro blocks are the (CKIti). A VLSI chip-set which integrates various standard peripheral LSIs is highly required by system vendors so that a small system with low Power consumption can be realized. In this case, the chip-set should be software-compatible with the off-the-shelf standard peripheral LSIs, and should be developedin shortperiod. A simple way of implementing such VLSIs without modifying the original LSIS tends to have enormous chip area. Entirely new design of standard LSI by another technology, such as standard cell approach, also has enormous man-power to modify existing standard LSI circuit for standard cell. mozified versions of standard m&roprocessor peripheral controllers. Features of mega-macros are shown in Table 2. Use of a mega-macro block reduces the number of transistors and area size, compared to the standard cell approach. For example, the PI0 mega-macro block has 2,500 transistors, however it would have 4,400 transistors if it were designed by using standard cell technique. In the PERI-chip case, this technique has reduced 37% of total chip size than the standard cell design. The original layout of standard LSIs were used as first approximation of mega-macro blocks, then VO pads were stripped out to have the smallest block area. It has brought 25% to 54% of area reduction, compared to ones with The chip-set has been developed to fulfill these I/O Dads. The oumut drivers of each mega-macro block has requirements by utilizing following techniques: * Peripheral megamacro block made of standard LSI * Hierarchical automatic design system * Double metal-layer 1.5pn CMOS process technology Use of standard LSI as the base of mega-macro block as well as automatic layout system has reduced man-vower. comoared beeiredesigned tobe able to drive the intehal common-bus. Process Conversion : BC and DMAC in the PERI chip have been redesigned for mega-macro implementation in order to unify the process technology. The double metal-layer Drocess technoloev. which can be easilv transferred from the IO manual implkmentstion. Double metal-lay& technology also realized reasonable chip size, although original LSIs were briginal single &&-layer pmcess. was ;mployed to utiliic the original lsyout design. realized by single metal-layer technolog< The process technology also enables high design flexibility of automatic layout design, maintaining original LSIs performance. The chip-set has been fabricated by 1.5pm double metal layer CMOS technology and approximately 205K transistors have been integrated in the chip-set. It has eight peripherals functions, and has realized 114 of power consumption than the standard LSI based system. Chip-Set Structure : Chip-set structure is shown in Fig.1. Each chip contains two different types of blocks: mega-macro blocks and custom-macro blocks. The P E N chip has eleven mega-macro blocks in seven types. 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引用次数: 0

摘要

本文将介绍一种用于个人计算机的vu1芯片组。它由外设控制器(PERIJ)、文本控制器(CRZT)和图形控制器(CRTG)组成。该芯片充分利用了分层自动布局设计系统。205K晶体管由三芯片组集成。采用I.5pm双金属层CMOS工艺技术制备。该芯片组允许设计m大小的个人计算机,包括CPU、内存和一些接口逻辑。个人电脑只消耗百分之114的电力。与具有相同系统配置的标准版本相比。介绍了一种用于个人计算机的VLSI芯片组。该设备由外围控制器(PERI)、文本控制器(CRm)、图形控制器总线和地址总线组成。总线控制器给总线接口控制信号,如存储器读写和I10读写,给宏块。提供自定义宏块来实现自定义功能,如设备的定时控制、外部接口、片外存储器接口等。标准单元格方法实现了这些自定义宏。芯片的显微照片如图3所示。CRTT包含一个图形显示控制器(GDC)宏和5.4门自定义宏。CRTG包含一个GDC和11.5 k栅极自定义宏。表1总结了三种芯片的特点。图4显示了一个通过芯片组配置PC系统的示例。如图所示,除了ROM/RAM和CPU之外,只需要接口逻辑。超级宏块:超级宏块是(CKIti)。系统厂商对集成各种标准外设lsi的VLSI芯片组提出了很高的要求,以实现低功耗的小系统。在这种情况下,芯片组应该与现成的标准外设lsi软件兼容,并且应该在短时间内开发完成。实现这种vlsi而不修改原始LSIS的简单方法往往具有巨大的芯片面积。采用另一种技术,如标准单元法来设计全新的标准LSI,也需要大量的人力来修改现有的标准LSI电路以适应标准单元。标准m&roprocessor外设控制器的授权版本。表2显示了巨型宏的特性。与标准单元方法相比,使用宏块可以减少晶体管的数量和面积大小。例如,PI0兆宏模块有2500个晶体管,但如果使用标准单元技术设计,它将有4400个晶体管。在佩里芯片的情况下,该技术比标准电池设计减少了总芯片尺寸的37%。使用标准lsi的原始布局作为宏块的第一近似,然后剥离VO焊盘以获得最小的块面积。它带来了25%到54%的面积减少,相比之下,芯片组已经开发,以满足这些I/O爸爸。采用标准LSI制作外设超大宏块,采用层次化自动设计系统,采用双金属层1.5pn CMOS工艺技术,采用标准LSI作为超大宏块的基础,采用自动布局系统,减少了人工成本。比较被重新设计为能够驱动内部公共总线。工艺转换:为了统一工艺技术,对PERI芯片中的BC和DMAC进行了重新设计,以实现宏实现。双金属层工艺技术。这可以很容易地从IO手动实现中转移过来。双金属层技术也实现了合理的芯片尺寸,虽然原来的lsi是原始的单层工艺。被用来利用原来的布局设计。该工艺技术还实现了自动布局设计的高设计灵活性,保持了lsi的原始性能。该芯片组采用1.5pm双金属层CMOS技术制造,芯片组中集成了大约205K晶体管。它具有8种外设功能,比标准的基于LSI的系统功耗降低了114。芯片集结构:芯片集结构如图1所示。每个芯片包含两种不同类型的块:巨型宏块和自定义宏块。该芯片有7种类型的11个宏块。它们是:软盘控制器(FDC), 8级优先输入控制器(PIC), 4通道8- bidbit DMA控制器(DMAC), 3通道16位定时器(TIM),总线控制器(BC),同步/异步串行110控制器(SIO)。和三字节并行YO控制器(PIO)。此外,它还具有5k门自定义宏来实现其他功能。框图如图2所示。在芯片中,宏块通过内部数据相互连接。 自动设计:采用层次化自动布局系统设计芯片组。该系统采用了三个自动排样程序。多单元布局程序设计自定义宏块。芯片的分层布局设计要求布局程序对不同尺寸和形状的各种宏块进行放置和互连。Floor Planner和Building Block Layout Program分别应用于宏块的放置和相互连接。该布局体系和设计流程如图5所示。首先,Floor Planner在实际设计每个自定义宏块之前进行宏块放置。它试图通过确定每个自定义宏块的大小、长宽比和终端位置来将宏块放置在最小的区域。平面图确定后,根据平面图结果进行自定义宏块的布置。然后,自定义宏块、超大宏块和VO块通过构建块布局程序相互连接。这个过程在较短的TAT(周转时间)内迭代,直到达到最佳布局。这种自动的方法带来了
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VLSI chip-set for personal computers
This paper will describe a V U 1 chip-set for Personal Computers. It consists of Peripheral Controller (PERIJ made of I1 standard peripheral mega-macro block, Text Controller (CRZT), and Graphics Controller (CRTG). The chips fully utilize hierarchical automatic layout design system. 205K transistors have been integrated by a three chip-set. They have been fabricated by I.5pm double metal-layer CMOS process technology. The chip-set allows to design a personal computer of M-size with CPU, memory and some inteqace logics. The personal computer consumes only 114 of power. compared to a standard version with the same system configuration. Introduction : This paper describes a VLSI chip-set for Personal Computers. The set consists of Peripheral Controller (PERI), Text Controller (CRm), and Graphics Controller bus and address bus. Bus controller gives bus interface Control signals, such as memory readlwrite and I10 readwrite, to mega-macro blocks. Custom-macro blocks are provided to realize user-defined functions, such as timing control of the device, extemal interface, offchip memory interface, and so on. Standard cell approach realizes these custom-macros. Microphotograph of the chip is shown in Fig.3. The CRTT contains a Graphic Display Controller (GDC) mega-macro and 5.4K-gate custom-macro.The CRTG contains a GDC and 11 .5K-gate custom-macro. Table 1 summarizes features of three chips. Fig.4 shows an example of PC system configuration by the chip-set. As is shown, only the interface logics are required, in addition to ROM/RAM and CPU. Mega-Macro Blocks : The mega-macro blocks are the (CKIti). A VLSI chip-set which integrates various standard peripheral LSIs is highly required by system vendors so that a small system with low Power consumption can be realized. In this case, the chip-set should be software-compatible with the off-the-shelf standard peripheral LSIs, and should be developedin shortperiod. A simple way of implementing such VLSIs without modifying the original LSIS tends to have enormous chip area. Entirely new design of standard LSI by another technology, such as standard cell approach, also has enormous man-power to modify existing standard LSI circuit for standard cell. mozified versions of standard m&roprocessor peripheral controllers. Features of mega-macros are shown in Table 2. Use of a mega-macro block reduces the number of transistors and area size, compared to the standard cell approach. For example, the PI0 mega-macro block has 2,500 transistors, however it would have 4,400 transistors if it were designed by using standard cell technique. In the PERI-chip case, this technique has reduced 37% of total chip size than the standard cell design. The original layout of standard LSIs were used as first approximation of mega-macro blocks, then VO pads were stripped out to have the smallest block area. It has brought 25% to 54% of area reduction, compared to ones with The chip-set has been developed to fulfill these I/O Dads. The oumut drivers of each mega-macro block has requirements by utilizing following techniques: * Peripheral megamacro block made of standard LSI * Hierarchical automatic design system * Double metal-layer 1.5pn CMOS process technology Use of standard LSI as the base of mega-macro block as well as automatic layout system has reduced man-vower. comoared beeiredesigned tobe able to drive the intehal common-bus. Process Conversion : BC and DMAC in the PERI chip have been redesigned for mega-macro implementation in order to unify the process technology. The double metal-layer Drocess technoloev. which can be easilv transferred from the IO manual implkmentstion. Double metal-lay& technology also realized reasonable chip size, although original LSIs were briginal single &&-layer pmcess. was ;mployed to utiliic the original lsyout design. realized by single metal-layer technolog< The process technology also enables high design flexibility of automatic layout design, maintaining original LSIs performance. The chip-set has been fabricated by 1.5pm double metal layer CMOS technology and approximately 205K transistors have been integrated in the chip-set. It has eight peripherals functions, and has realized 114 of power consumption than the standard LSI based system. Chip-Set Structure : Chip-set structure is shown in Fig.1. Each chip contains two different types of blocks: mega-macro blocks and custom-macro blocks. The P E N chip has eleven mega-macro blocks in seven types. They are: Floppy Disk Controller (FDC), 8-level pn’ority Intempt Controller (PIC), 4-channel 8-biUldbit DMA Controller (DMAC), 3-channel 16-bit Timer (TIM), Bus Controller (BC), SynchronousIAsynchronous Serial 110 Controller (SIO). and triple byte-wise Parallel YO Controller (PIO). In addition, it has 5K-gate custom-macro to implement other functions. Block diagram is shown in Fig.2. In the chip, mega-macro blocks are interconnected through the intemal data . Automatic Design : The chip-set was designed by using hierarchical automatic layout system. Three automatic layout programs were employed in this system. Poly-Cell Layout Program designs custom-macro blocks. Hierarchical layout design of the chip requires layout programs to place and interconnect various macro blocks in different sizes and shapes. Floor Planner and Building Block Layout Program has been applied to placements and interconnections of macro blocks,respectively. Fig. 5 shows this layout system and design flow. First, the Floor Planner does macro block placements prior to the actual design of each custom-macro block. It tries to place macro blocks in smallest area by determining the size, aspect ratio, and terminal positions of each custom-macro block. Once the floor plan is decided, custom-macro blocks are laid out according to the result of floor plan. Then, custom-macro blocks, mega-macro blocks, and VO blocks are interconnected by the Building Block Layout Program. This process is iterated in short TAT (turn-around time), until optimal layout is achieved.This automatic approach has brought
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