片上系统的整体设计方法

2009 IEEE International SOC Conference (SOCC) Pub Date : 2009-09-01 DOI:10.1109/SOCCON.2009.5398035

F. Dielacher, Christian Vogel, P. Singerl, S. Mendel, A. Wiesbauer

{"title":"片上系统的整体设计方法","authors":"F. Dielacher, Christian Vogel, P. Singerl, S. Mendel, A. Wiesbauer","doi":"10.1109/SOCCON.2009.5398035","DOIUrl":null,"url":null,"abstract":"We exemplify the possibilities of a holistic design approach for systems on chip. After recapitulating basic observations for next generation systems, we outline the advantages and challenges of a holistic design approach. The discussion is supported by real world examples.","PeriodicalId":303505,"journal":{"name":"2009 IEEE International SOC Conference (SOCC)","volume":"7 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2009-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"A holistic design approach for systems on chip\",\"authors\":\"F. Dielacher, Christian Vogel, P. Singerl, S. Mendel, A. Wiesbauer\",\"doi\":\"10.1109/SOCCON.2009.5398035\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We exemplify the possibilities of a holistic design approach for systems on chip. After recapitulating basic observations for next generation systems, we outline the advantages and challenges of a holistic design approach. The discussion is supported by real world examples.\",\"PeriodicalId\":303505,\"journal\":{\"name\":\"2009 IEEE International SOC Conference (SOCC)\",\"volume\":\"7 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2009-09-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2009 IEEE International SOC Conference (SOCC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/SOCCON.2009.5398035\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2009 IEEE International SOC Conference (SOCC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SOCCON.2009.5398035","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 3

摘要

我们举例说明了芯片系统整体设计方法的可能性。在概述了下一代系统的基本观察之后，我们概述了整体设计方法的优势和挑战。本文的讨论得到了实际例子的支持。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文

微信好友朋友圈 QQ好友复制链接

本刊更多论文

A holistic design approach for systems on chip

We exemplify the possibilities of a holistic design approach for systems on chip. After recapitulating basic observations for next generation systems, we outline the advantages and challenges of a holistic design approach. The discussion is supported by real world examples.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

2009 IEEE International SOC Conference (SOCC)

自引率

0.00%

发文量