Solvent effect on the morphology of copper (I) oxide: A fundamental study towards copper (I) oxide-epoxy composites

The study on the influence of solvent environments on the Cu2O particles preparation via aqueous to organic phase transfer technique is described. In aqueous, the morphologies of the as-formed particles are of whisker-like or ellipsoidal shape dependent on the amount of CTAB used. At lower concentration of CTAB (r=2.7), Cu2O particles tend to form bundle of fine needle-like structures with an average diameter of 14.1±4.3 nm. Upon phase transfer process, transformation of Cu2O morphology occurred. Two organic solvents namely chloroform and toluene is studied. Chloroform with higher dielectric constant and dipole moment exert better particle-solvent interaction thus give better particle dispersion as compared to toluene. Addition of 10% v/v epoxy in the organic solvent further affects the particles morphology. Spherical particles as small as 8.1 ± 2.1 nm are obtained for Cu2O particles transferred into the 10%v/v epoxy/chloroform. Better solvation of epoxy resin in chloroform makes it a better stabilizer thus protecting the particles from agglomeration and secondary growth.