The Reconfigurable Flip Chip Assembly System

The electronic industry developed and expanded explosively. By increasingly using flip chip (FC) packaging technology, the boundary between three levels of packaging of micro-electronic systems became indistinct. The trend towards portable and hand-held devices also enlarges the market share of FC packaging, which is the major packaging technology. Rapidly changing micro-electronic market calls for reconfigurable micro-electronic assembly systems with product variability, responsiveness, non-obsolescence, and cost-effectiveness. The introduction of FC technology and reconfigurability of assembly system are discussed in this paper, and a reconfigurable FC assembly system is presented