10gb /s × 12ch小尺寸光模块,带导电膜连接器

A. Suzuki, T. Ishikawa, Y. Wakazono, D. Nagao, T. Hino, Y. Hashimoto, H. Masuda, S. Suzuki, M. Tamura, T.-i. Suzuki, K. Kikuchi, Y. Okada, H. Nakagawa, M. Aoyaghi, T. Mikawa
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引用次数: 7

摘要

我们演示了用于光互连的高密度、低成本12通道光模块的10gb /s/ch操作。我们开发的这些光模块被设计成可插入带有电连接器的卡片。这些可插拔模块将使卡的制造更加容易,因为它们允许光模块和卡的制造过程分开。带夹簧的电连接器用于将陶瓷基板与印刷电路板(PCB)连接起来。各向异性导电膜(ACF)用于在陶瓷基板和PCB之间传输电信号。为了实现光耦合,光纤与安装在陶瓷基板上的空腔中的光学器件对接耦合。使用在陶瓷基板中制造的导针和在光学连接器中制造的导孔来实现十二根光纤与12通道光学器件之间的对准。
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10-Gb/s × 12-ch downsized optical modules with electrical conductive film connector
We demonstrate 10-Gb/s/ch operations of high-density, low-cost 12-channel optical modules for optical interconnections. These optical modules that we developed are designed to be pluggable into cards with an electrical connector. These pluggable modules will enable cards to be manufactured much more easily since they allow the manufacturing processes of optical modules and cards to be separated. An electrical connector with a clamp spring is used to connect a ceramic substrate with a printed circuit board (PCB). An anisotropic conductive film (ACF) is used to transmit electrical signals between the ceramic substrate and the PCB. To achieve optical coupling, optical fibers are butt-coupled with optical devices mounted in a cavity on the ceramic substrate. Alignment between the twelve optical fibers and the 12-channel optical device is achieved using guide pins fabricated in the ceramic substrate and guide holes fabricated in the optical connector.
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