R. Carter, J. Mazurier, L. Pirro, J.-U. Sachse, P. Baars, J. Faul, C. Grass, G. Grasshoff, P. Javorka, T. Kammler, A. Preusse, S. Nielsen, T. Heller, J. Schmidt, H. Niebojewski, P. Chou, E. Smith, E. Erben, C. Metze, C. Bao, Y. Andee, I. Aydin, S. Morvan, J. Bernard, E. Bourjot, T. Feudel, D. Harame, R. Nelluri, H.-J. Thees, L. M-Meskamp, J. Kluth, R. Mulfinger, M. Rashed, R. Taylor, C. Weintraub, J. Hoentschel, M. Vinet, J. Schaeffer, B. Rice
{"title":"22nm FDSOI技术,适用于新兴的移动、物联网和射频应用","authors":"R. Carter, J. Mazurier, L. Pirro, J.-U. Sachse, P. Baars, J. Faul, C. Grass, G. Grasshoff, P. Javorka, T. Kammler, A. Preusse, S. Nielsen, T. Heller, J. Schmidt, H. Niebojewski, P. Chou, E. Smith, E. Erben, C. Metze, C. Bao, Y. Andee, I. Aydin, S. Morvan, J. Bernard, E. Bourjot, T. Feudel, D. Harame, R. Nelluri, H.-J. Thees, L. M-Meskamp, J. Kluth, R. Mulfinger, M. Rashed, R. Taylor, C. Weintraub, J. Hoentschel, M. Vinet, J. Schaeffer, B. Rice","doi":"10.1109/iedm.2016.7838029","DOIUrl":null,"url":null,"abstract":"22FDX™ is the industry's first FDSOI technology architected to meet the requirements of emerging mobile, Internet-of-Things (IoT), and RF applications. This platform achieves the power and performance efficiency of a 16/14nm FinFET technology in a cost effective, planar device architecture that can be implemented with ∼30% fewer masks. Performance comes from a second generation FDSOI transistor, which produces nFET (pFET) drive currents of 910μΑ/μm (856μΑ/μm) at 0.8 V and 100nA/μm Ioff. For ultra-low power applications, it offers low-voltage operation down to 0.4V V<inf>min</inf> for 8T logic libraries, as well as 0.62V and 0.52V V<inf>min</inf> for high-density and high-current bitcells, ultra-low leakage devices approaching 1pA/μm I<inf>off</inf>, and body-biasing to actively trade-off power and performance. Superior RF/Analog characteristics to FinFET are achieved including high f<inf>T</inf>/f<inf>MAx</inf> of 375GHz/290GHz and 260GHz/250GHz for nFET and pFET, respectively. The high f<inf>MAx</inf> extends the capabilities to 5G and milli-meter wave (>24GHz) RF applications.","PeriodicalId":186544,"journal":{"name":"2016 IEEE International Electron Devices Meeting (IEDM)","volume":"4 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"173","resultStr":"{\"title\":\"22nm FDSOI technology for emerging mobile, Internet-of-Things, and RF applications\",\"authors\":\"R. Carter, J. Mazurier, L. Pirro, J.-U. Sachse, P. Baars, J. Faul, C. Grass, G. Grasshoff, P. Javorka, T. Kammler, A. Preusse, S. Nielsen, T. Heller, J. Schmidt, H. Niebojewski, P. Chou, E. Smith, E. Erben, C. Metze, C. Bao, Y. Andee, I. Aydin, S. Morvan, J. Bernard, E. Bourjot, T. Feudel, D. Harame, R. Nelluri, H.-J. Thees, L. M-Meskamp, J. Kluth, R. Mulfinger, M. Rashed, R. Taylor, C. Weintraub, J. Hoentschel, M. Vinet, J. Schaeffer, B. Rice\",\"doi\":\"10.1109/iedm.2016.7838029\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"22FDX™ is the industry's first FDSOI technology architected to meet the requirements of emerging mobile, Internet-of-Things (IoT), and RF applications. This platform achieves the power and performance efficiency of a 16/14nm FinFET technology in a cost effective, planar device architecture that can be implemented with ∼30% fewer masks. Performance comes from a second generation FDSOI transistor, which produces nFET (pFET) drive currents of 910μΑ/μm (856μΑ/μm) at 0.8 V and 100nA/μm Ioff. For ultra-low power applications, it offers low-voltage operation down to 0.4V V<inf>min</inf> for 8T logic libraries, as well as 0.62V and 0.52V V<inf>min</inf> for high-density and high-current bitcells, ultra-low leakage devices approaching 1pA/μm I<inf>off</inf>, and body-biasing to actively trade-off power and performance. Superior RF/Analog characteristics to FinFET are achieved including high f<inf>T</inf>/f<inf>MAx</inf> of 375GHz/290GHz and 260GHz/250GHz for nFET and pFET, respectively. The high f<inf>MAx</inf> extends the capabilities to 5G and milli-meter wave (>24GHz) RF applications.\",\"PeriodicalId\":186544,\"journal\":{\"name\":\"2016 IEEE International Electron Devices Meeting (IEDM)\",\"volume\":\"4 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2016-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"173\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2016 IEEE International Electron Devices Meeting (IEDM)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/iedm.2016.7838029\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 IEEE International Electron Devices Meeting (IEDM)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/iedm.2016.7838029","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
22nm FDSOI technology for emerging mobile, Internet-of-Things, and RF applications
22FDX™ is the industry's first FDSOI technology architected to meet the requirements of emerging mobile, Internet-of-Things (IoT), and RF applications. This platform achieves the power and performance efficiency of a 16/14nm FinFET technology in a cost effective, planar device architecture that can be implemented with ∼30% fewer masks. Performance comes from a second generation FDSOI transistor, which produces nFET (pFET) drive currents of 910μΑ/μm (856μΑ/μm) at 0.8 V and 100nA/μm Ioff. For ultra-low power applications, it offers low-voltage operation down to 0.4V Vmin for 8T logic libraries, as well as 0.62V and 0.52V Vmin for high-density and high-current bitcells, ultra-low leakage devices approaching 1pA/μm Ioff, and body-biasing to actively trade-off power and performance. Superior RF/Analog characteristics to FinFET are achieved including high fT/fMAx of 375GHz/290GHz and 260GHz/250GHz for nFET and pFET, respectively. The high fMAx extends the capabilities to 5G and milli-meter wave (>24GHz) RF applications.