{"title":"微电子冷却和半热:回顾","authors":"R. Simons","doi":"10.1109/STHERM.1994.289000","DOIUrl":null,"url":null,"abstract":"For the occasion of the 10th anniversary of the SEMI-THERM conference, this paper provides a look back at some of the developments that have taken place since its founding. Topics covered include thermal measurement, thermal characterization, thermal analysis and modeling, air cooling, water cooling, and immersion cooling.<<ETX>>","PeriodicalId":107140,"journal":{"name":"Proceedings of 1994 IEEE/CHMT 10th Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM)","volume":"3 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1994-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"14","resultStr":"{\"title\":\"Microelectronics cooling and SEMI-THERM: a look back\",\"authors\":\"R. Simons\",\"doi\":\"10.1109/STHERM.1994.289000\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"For the occasion of the 10th anniversary of the SEMI-THERM conference, this paper provides a look back at some of the developments that have taken place since its founding. Topics covered include thermal measurement, thermal characterization, thermal analysis and modeling, air cooling, water cooling, and immersion cooling.<<ETX>>\",\"PeriodicalId\":107140,\"journal\":{\"name\":\"Proceedings of 1994 IEEE/CHMT 10th Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM)\",\"volume\":\"3 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1994-02-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"14\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of 1994 IEEE/CHMT 10th Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/STHERM.1994.289000\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of 1994 IEEE/CHMT 10th Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/STHERM.1994.289000","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Microelectronics cooling and SEMI-THERM: a look back
For the occasion of the 10th anniversary of the SEMI-THERM conference, this paper provides a look back at some of the developments that have taken place since its founding. Topics covered include thermal measurement, thermal characterization, thermal analysis and modeling, air cooling, water cooling, and immersion cooling.<>