TaOx和TiOx基rram中电场依赖性电生成活化能的比较

Abhishek A. Sharma, M. Noman, M. Skowronski, J. Bain
{"title":"TaOx和TiOx基rram中电场依赖性电生成活化能的比较","authors":"Abhishek A. Sharma, M. Noman, M. Skowronski, J. Bain","doi":"10.1109/IIRW.2013.6804180","DOIUrl":null,"url":null,"abstract":"Oxide based resistive switching memories are considered to be one of the front-runners for the next generation non-volatile memories. Forming, the critical one time programming process, is not well understood. In this work, we try to understand the dynamics of forming process in two model systems - TaOx and TiOx, and compare the similarities and the universality in its control parameters. After comparing the time, voltage and temperature dependent dynamics, we find that a 1/E (E being electric field) dependence causes the activation energy to reduce by more than an order of magnitude.","PeriodicalId":287904,"journal":{"name":"2013 IEEE International Integrated Reliability Workshop Final Report","volume":"63 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2013-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"Comparison of electric field dependent activation energy for electroformation in TaOx and TiOx based RRAMs\",\"authors\":\"Abhishek A. Sharma, M. Noman, M. Skowronski, J. Bain\",\"doi\":\"10.1109/IIRW.2013.6804180\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Oxide based resistive switching memories are considered to be one of the front-runners for the next generation non-volatile memories. Forming, the critical one time programming process, is not well understood. In this work, we try to understand the dynamics of forming process in two model systems - TaOx and TiOx, and compare the similarities and the universality in its control parameters. After comparing the time, voltage and temperature dependent dynamics, we find that a 1/E (E being electric field) dependence causes the activation energy to reduce by more than an order of magnitude.\",\"PeriodicalId\":287904,\"journal\":{\"name\":\"2013 IEEE International Integrated Reliability Workshop Final Report\",\"volume\":\"63 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2013-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2013 IEEE International Integrated Reliability Workshop Final Report\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IIRW.2013.6804180\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2013 IEEE International Integrated Reliability Workshop Final Report","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IIRW.2013.6804180","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 4

摘要

基于氧化物的电阻开关存储器被认为是下一代非易失性存储器的领跑者之一。成形这一关键的一次性编程过程还没有得到很好的理解。在这项工作中,我们试图了解两种模型系统- TaOx和TiOx的成形过程动力学,并比较其控制参数的相似性和通用性。在比较了时间、电压和温度相关的动态后,我们发现1/E (E为电场)相关导致活化能降低了一个数量级以上。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
Comparison of electric field dependent activation energy for electroformation in TaOx and TiOx based RRAMs
Oxide based resistive switching memories are considered to be one of the front-runners for the next generation non-volatile memories. Forming, the critical one time programming process, is not well understood. In this work, we try to understand the dynamics of forming process in two model systems - TaOx and TiOx, and compare the similarities and the universality in its control parameters. After comparing the time, voltage and temperature dependent dynamics, we find that a 1/E (E being electric field) dependence causes the activation energy to reduce by more than an order of magnitude.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Electromigration enhanced growth of intermetallic compound in solder bumps Overlap design for higher tungsten via robustness in AlCu metallizations Zero/low field SDR and SDT used for atomic scale probes of NBTI and TDDB Recent advances in dielectric breakdown of modern gate dielectrics Electromigration induced stress in open TSVs
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1