{"title":"一个使用串行通信的浮点收缩数组处理元件","authors":"T. Davies, D. Al-Khalili, V. Szwarc","doi":"10.1109/EASIC.1990.207947","DOIUrl":null,"url":null,"abstract":"The authors describe the design of a processing element (PE) for systolic array applications. The PE which is configured as a multiplier-accumulator or an inner product step processor, supports most common systolic algorithms in signal processing and matrix arithmetic. Communication with neighbouring PEs is achieved through 18 on-chip serial links, each operating at 50 Mb per second. The 30 K transistor ASIC device is implemented in 2 micron HCMOS gate array technology, packaged in a 48 pin DIP and performs at 10 MFLOPS.<<ETX>>","PeriodicalId":205695,"journal":{"name":"[Proceedings] EURO ASIC `90","volume":"12 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1990-05-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"A floating-point systolic array processing element using serial communication\",\"authors\":\"T. Davies, D. Al-Khalili, V. Szwarc\",\"doi\":\"10.1109/EASIC.1990.207947\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The authors describe the design of a processing element (PE) for systolic array applications. The PE which is configured as a multiplier-accumulator or an inner product step processor, supports most common systolic algorithms in signal processing and matrix arithmetic. Communication with neighbouring PEs is achieved through 18 on-chip serial links, each operating at 50 Mb per second. The 30 K transistor ASIC device is implemented in 2 micron HCMOS gate array technology, packaged in a 48 pin DIP and performs at 10 MFLOPS.<<ETX>>\",\"PeriodicalId\":205695,\"journal\":{\"name\":\"[Proceedings] EURO ASIC `90\",\"volume\":\"12 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1990-05-29\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"[Proceedings] EURO ASIC `90\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EASIC.1990.207947\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"[Proceedings] EURO ASIC `90","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EASIC.1990.207947","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A floating-point systolic array processing element using serial communication
The authors describe the design of a processing element (PE) for systolic array applications. The PE which is configured as a multiplier-accumulator or an inner product step processor, supports most common systolic algorithms in signal processing and matrix arithmetic. Communication with neighbouring PEs is achieved through 18 on-chip serial links, each operating at 50 Mb per second. The 30 K transistor ASIC device is implemented in 2 micron HCMOS gate array technology, packaged in a 48 pin DIP and performs at 10 MFLOPS.<>